Degrenne, N.
11  Ergebnisse:
Personensuche X
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1

Temperature Evolution as an effect of Wire-bond Failures in..:

, In: 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe),
Degrenne, N. ; Delamea, R. ; Mollov, S. - p. P.1-P.8 , 2020
 
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2

Wire-bond contact degradation modeling for remaining useful..:

Nazar, M. ; Ibrahim, A. ; Khatir, Z...
Microelectronics Reliability.  114 (2020)  - p. 113824 , 2020
 
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3

Using of bond-wire resistance as aging indicator of semicon..:

Ibrahim, A. ; Khatir, Z. ; Ousten, J.P....
Microelectronics Reliability.  114 (2020)  - p. 113757 , 2020
 
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4

Analysis of the aging mechanism occurring at the bond-wire ..:

Dornic, N. ; Ibrahim, A. ; Khatir, Z....
Microelectronics Reliability.  114 (2020)  - p. 113873 , 2020
 
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6

Real-life vs. standard driving cycles and implications on E..:

, In: IECON 2016 - 42nd Annual Conference of the IEEE Industrial Electronics Society,
Degrenne, N. ; Mollov, S. - p. 2177-2182 , 2016
 
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10

Les populations de saumons, truites de mer et grandes alose..:

Lange, Frédéric ; Prévost, Etienne ; Brun, Mélanie...
Les populations de saumons, truites de mer et grandes aloses de la Nivelle en 2010(2011).  , 2011
 
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