Ding, Dongdong
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5

Numerical study of the effect of epoxy molding compound gra..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Lu, Xiaoxin ; Zhou, Yu ; Ding, Dongdong.. - p. 1-4 , 2023
 
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An accurate numerical prediction for the thermal conductivi..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Lu, Xiaoxin ; Huang, Jiabin ; Cheng, Nan... - p. 1-4 , 2023
 
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11

Research and Application of Automatic Selection Device for ..:

, In: 2022 IEEE 13th International Conference on Mechanical and Intelligent Manufacturing Technologies (ICMIMT),
Xue, Guangku ; Lan, Yulong ; Wang, Xiaogang... - p. 270-274 , 2022
 
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