Ding, Shengchang
36  Ergebnisse:
Personensuche X
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2

Accurate Identification of Viscoelastic Constitutive Equati..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhou, Yu ; Lu, Xiaoxin ; Ding, Shengchang.. - p. 1-4 , 2023
 
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3

Toward soft, stretchable and resilient high filled composit..:

Fan, Jianfeng ; Wong, Chunyu ; Wu, Weijian...
Composites Science and Technology.  242 (2023)  - p. 110206 , 2023
 
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5

Optimizing Thermal Properties of Thermal Interface Material..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Ding, Shengchang ; He, Dongyi ; Cai, Linfeng... - p. 1-5 , 2022
 
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9

High thermal conductivity and remarkable damping composite ..:

Sheng-Chang Ding ; Jian-Feng Fan ; Dong-Yi He...
http://www.sciencedirect.com/science/article/pii/S2709472322000119.  , 2022
 
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11

Double-Side Cooled SiC MOSFET Power Modules With Sintered-S..:

Ding, Chao ; Lu, Shengchang ; Zhang, Zichen...
IEEE Transactions on Power Electronics.  38 (2023)  8 - p. 9685-9694 , 2023
 
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12

Joint Graph Convolutional Network and Convolutional Neural ..:

, In: 2023 3rd International Conference on Frontiers of Electronics, Information and Computation Technologies (ICFEICT),
Wang, Hui ; Ding, Di ; Li, Zhiwen.. - p. 436-442 , 2023
 
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14

Multi-Relational Graph Convolutional Network Based on Relat..:

, In: 2021 2nd International Conference on Computer Science and Management Technology (ICCSMT),
Ding, Lianhong ; Gao, Shengchang - p. 52-55 , 2021
 
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