Du, Bo‐Sian
7  Ergebnisse:
Personensuche X
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1

A Composite Structure of Low Dielectric Substrate for the S..:

, In: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lee, Wei-Chih ; Du, Bo-Sian - p. 177-179 , 2019
 
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2

A Composite Structure of Low Dielectric Substrate for 5G mm..:

, In: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lee, Wei-Chih ; Du, Bo-Sian - p. 108-111 , 2019
 
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6

22.2: Invited Paper: Flexible Polymer Electrets for Flexibl..:

Chiang, Dar‐Ming ; Chen, Jen‐Luan ; Du, Bo‐Sian..
SID Symposium Digest of Technical Papers.  42 (2011)  1 - p. 280-283 , 2011
 
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