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Du, Leiming
~ 100  Ergebnisse:
Personensuche X
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1

New insights into microstructure refinement in crack initia..:

Du, Leiming ; Pan, Xiangnan ; Hong, Youshi
Materialia.  33 (2024)  - p. 102008 , 2024
Link: https://doi.org/10.1016/..
 
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2

Microscopic fracture toughness of notched porous sintered C..:

Hu, Dong ; Du, Leiming ; Alfreider, Markus...
Materials Science and Engineering: A.  897 (2024)  - p. 146316 , 2024
Link: https://doi.org/10.1016/..
 
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3

Multi-parameters optimization for electromigration in WLCSP..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Du, Leiming ; Deng, Shanliang ; Cui, Zhen... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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4

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nan..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ji, Xinrui ; Du, Leiming ; van Zeijl, Henk... - p. 1891-1895 , 2024
Link: https://doi.org/10.1109/..
 
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5

Measuring residual stresses in individual on-chip interconn..:

Zhang, Yaqian ; Du, Leiming ; Bäcke, Olof...
Applied Physics Letters.  124 (2024)  8 - p. , 2024
Link: https://doi.org/10.1063/..
 
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6

Microstructure features induced by fatigue crack initiation..:

Pan, Xiangnan ; Du, Leiming ; Qian, Guian.
Journal of Materials Science & Technology.  173 (2024)  - p. 247-260 , 2024
Link: https://doi.org/10.1016/..
 
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7

Investigating Mechanical Properties of Silicon Carbide Coat..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
Mo, Jiarui ; Schaffar, Gerald J.K. ; Du, Leiming... - p. 626-629 , 2024
Link: https://doi.org/10.1109/..
 
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8

High temperature viscoplastic deformation behavior of sinte..:

Hu, Dong ; Qian, Cheng ; Liu, Xu...
Journal of Materials Research and Technology.  26 (2023)  - p. 3183-3200 , 2023
Link: https://doi.org/10.1016/..
 
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9

Microstructural and micromechanical characterization of sin..:

Ji, Xinrui ; Du, Leiming ; He, Shan..
Microelectronics Reliability.  150 (2023)  - p. 115180 , 2023
Link: https://doi.org/10.1016/..
 
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10

Micro-cantilever Bending Test of Sintered Cu nanoparticles ..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Du, Leiming ; Hu, Dong ; Poelm, Rene.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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11

Connecting the macroscopic and mesoscopic properties of sin..:

Long, Xu ; Chong, Kainan ; Su, Yutai..
Engineering Fracture Mechanics.  281 (2023)  - p. 109137 , 2023
Link: https://doi.org/10.1016/..
 
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12

High-temperature creep properties of a novel solder materia..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Du, Leiming ; Zhao, Xiujuan ; Poelma, Rene.. - p. 392-395 , 2023
Link: https://doi.org/10.1109/..
 
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13

Low Temperature Fine Pitch All-Copper Interconnects Combini..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Ji, Xinrui ; Van Zeijl, Henk ; Jiao, Weiping... - p. 1237-1243 , 2023
Link: https://doi.org/10.1109/..
 
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14

Investigation of Potting Compounds on Thermal-Fatigue prope..:

, In: IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society,
Du, Leiming ; Zhao, Xiujuan ; Watte, Piet... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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15

The physical properties of γ-ray-quiet flat-spectrum radio ..:

Deng, Xue-Jiao ; Xue, Rui ; Wang, Ze-Rui...
Monthly Notices of the Royal Astronomical Society.  506 (2021)  4 - p. 5764-5773 , 2021
Link: https://doi.org/10.1093/..
 
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