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Dušek, Karel
352  Ergebnisse:
Personensuche X
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1

Board Level Underfill – Moisture Related Voids:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
Plachy, Zbynek ; Hurtony, Tamas ; Geczy, Attila. - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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2

Electrochemical Migration Resistance of Gold Surface Finish..:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
Klimtova, Marketa ; Vesely, Petr ; Kralova, Iva... - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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3

Implementation of microcontroller board on a sustainable an..:

Géczy, Attila ; Piffkó, Dániel ; Berényi, Richárd...
Nanotechnology.  , 2024
Link: https://doi.org/10.1088/..
 
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4

Influence of Reflow Temperature Profile on the Intermetalli..:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
Dusek, Karel ; Vesely, Petr ; Busek, David... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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5

Dispersion and incorporation of TiO2 and SiC nano-particles..:

Illés, Balázs ; Michałowski, Paweł Piotr ; Skwarek, Agata...
Scripta Materialia.  243 (2024)  - p. 115987 , 2024
Link: https://doi.org/10.1016/..
 
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6

Sustainable printed circuit board substrates based on flame..:

Farkas, Csaba ; Gál, László ; Csiszár, András...
Sustainable Materials and Technologies.  40 (2024)  - p. e00902 , 2024
Link: https://doi.org/10.1016/..
 
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7

Personal Air-Quality Monitoring with Sensor-Based Wireless ..:

Kuglics, Lajos ; Géczy, Attila ; Dusek, Karel..
Sensors.  24 (2024)  8 - p. 2601 , 2024
Link: https://doi.org/10.3390/..
 
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8

Electrochemical Migration: What Happens If a Drink Is Spill..:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
Vesely, Petr ; Senkyr, Jaroslav ; Klimtova, Marketa. - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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9

Effect of TiO2 Nanoparticles Addition on the Electrochemica..:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
Dayoub, Ali ; Gharaibeh, Ali ; Tamasi, Patrik... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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10

Occurrence of Voids in Soldered Joints for Electrical Engin..:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
Chvosta, Tomas ; Dusek, Karel ; Gurcik, Tomas - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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11

A Novel Approach for Temperature-Induced Ball Grid Array Co..:

Sorokina, Kristina ; Dušek, Karel ; Bušek, David
Materials.  17 (2024)  11 - p. 2693 , 2024
Link: https://doi.org/10.3390/..
 
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12

Wettability in lead-free soldering: Effect of plasma treatm..:

Králová, Iva ; Pilnaj, Dominik ; Pop-Georgievski, Ognen...
Applied Surface Science.  668 (2024)  - p. 160447 , 2024
Link: https://doi.org/10.1016/..
 
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13

Influence of No-Clean Flux on the Corrosivity of Various Su..:

, In: 2023 46th International Spring Seminar on Electronics Technology (ISSE),
Sorokina, Kristina ; Dusek, Karel ; Busek, David - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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14

Board Level Underfill – the Influence of Flux:

, In: 2023 46th International Spring Seminar on Electronics Technology (ISSE),
Plachy, Zbynek ; Hurtony, Tamas ; Geczy, Attila. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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15

Filtering Efficiency of Sustainable Textile Materials Appli..:

Géczy, Attila ; Havellant, Gergő ; Bátorfi, Réka...
Materials.  16 (2023)  3 - p. 903 , 2023
Link: https://doi.org/10.3390/..
 
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