Dutta, I.
2419  Ergebnisse:
Personensuche X
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1

Stereological Analysis of Microstructural Evolution Due to ..:

Chavali, S. ; Ganti, S. S. ; Liao, H....
Journal of Electronic Materials.  53 (2024)  3 - p. 1399-1413 , 2024
 
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2

Developing 4D Tracking Technology Using Centimeter-Scale AC..:

, In: 2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD),
Madrid, C. ; Heller, R. ; Martin, C. San... - p. 1-2 , 2023
 
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3

Soft ideals of soft ternary semigroups:

Kar, S. ; Dutta, I.
Heliyon.  7 (2021)  6 - p. e07330 , 2021
 
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4

Stuctures of Ternary Semigroup of Mappings:

Kar, S. ; Dutta, I. ; Shum, K. P.
Lobachevskii Journal of Mathematics.  41 (2020)  9 - p. 1653-1659 , 2020
 
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7

A Model for Intermetallic Growth in Thin Sn Joints Between ..:

Arafat, Y. ; Yang, H. ; Dutta, I...
Journal of Electronic Materials.  49 (2020)  5 - p. 3367-3382 , 2020
 
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10

Effect of Intermetallic Content on Shear Deformation of Thi..:

Ajay Kumar, P. ; Dutta, I.
Journal of Electronic Materials.  47 (2018)  9 - p. 5488-5497 , 2018
 
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11

Co-electrodeposition of tin with 0.2–20% indium: Implicatio..:

Das Mahapatra, S. ; Dutta, I.
Surface and Coatings Technology.  337 (2018)  - p. 478-483 , 2018
 
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12

Whisker Mitigation Mechanisms in Indium-Doped Tin Thin Film..:

Bhassyvasantha, S. ; Fredj, N. ; Mahapatra, S. D....
Journal of Electronic Materials.  47 (2018)  10 - p. 6229-6240 , 2018
 
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13

Response to "Comment on 'Electric current induced flow of l..:

Kumar, P. ; Dutta, I.
Journal of Applied Physics.  121 (2017)  13 - p. , 2017
 
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14

Role of surface oxide in mitigating tin whisker growth: A f..:

Mahapatra, S. Das ; Dutta, I.
Materials Science and Engineering: A.  706 (2017)  - p. 181-191 , 2017
 
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15

Eliminating Whisker Growth by Indium Addition in Electropla..:

Das Mahapatra, S. ; Majumdar, B. S. ; Dutta, I..
Journal of Electronic Materials.  46 (2016)  7 - p. 4062-4075 , 2016
 
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