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Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium ,
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Thermal Management on the Solder Joints of Adjacent Ball Gr..:
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2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) ,
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Intermetallic Compound Thickness of Ball Grid Array Solder ..:
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2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) ,
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Effects of Underfill Materials on Behavior of Intermetallic..:
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2021 IEEE Regional Symposium on Micro and Nanoelectronics (RSM) ,
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Effect of Single-Mode and Hetero-core Macrobend Fiber Optic:
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2019 IEEE Regional Symposium on Micro and Nanoelectronics (RSM) ,
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