Ehsan, Abang Annuar
45  Ergebnisse:
Personensuche X
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3

Thermal Management on the Solder Joints of Adjacent Ball Gr..:

, In: Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium,
 
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5

Cardinal and Ordinal Directions Approach in Investigating A..:

Ismail, Adlil Aizat ; Abu Bakar, Maria ; Ehsan, Abang Annuar...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  9 - p. 1492-1501 , 2022
 
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6

Intermetallic Compound Thickness of Ball Grid Array Solder ..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
 
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8

Effects of Underfill Materials on Behavior of Intermetallic..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
 
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10

Effect of Single-Mode and Hetero-core Macrobend Fiber Optic:

, In: 2021 IEEE Regional Symposium on Micro and Nanoelectronics (RSM),
 
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12

Manufacturing of Polymer-based 1×2 Y-branch Symmetric and A..:

Ghazali, Mohd Shafiq ; Mohd Romlay, Fadhlur Rahman ; Ehsan, Abang Annuar
International Journal of Automotive and Mechanical Engineering.  18 (2021)  3 - p. 8998-9005 , 2021
 
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13

Projection Optics Design for Projection Stereolithography 3..:

, In: 2019 IEEE Regional Symposium on Micro and Nanoelectronics (RSM),
 
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15

S-Bend Silicon-On-Insulator (SOI) Large Cross-Section Rib W..:

Zamhari, Nurdiani ; Ehsan, Abang Annuar ; Abdul Rahman, Mohd Syuhaimi
International Journal of Electrical and Computer Engineering (IJECE).  7 (2017)  6 - p. 3299 , 2017
 
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