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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Effect of Design Variables and System-Level Constraints on ..:
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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
3
Effect of Design Variables and System-Level Constraints on ..:
, In:
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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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A Single Flexible Coldplate Cools Multiple Devices:
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Satztypen und Konstruktionen ,
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