E-LIB Suche - Ergebnisse für: Engelmann, Hans-Jürgen

1

Effect of interface strength on electromigration-induced in..:

Zschech, Ehrenfried ; Engelmann, Hans-Jürgen ; Meyer, Moritz Andreas...
International Journal of Materials Research. 96 (2022) 9 - p. 966-971 , 2022

Link: https://doi.org/10.1515/..

2

CMOS compatible manufacturing of a hybrid SET-FET circuit:

del Moral, Alberto ; Amat, Esteve ; Engelmann, Hans-Jürgen...
Semiconductor Science and Technology. , 2022

Link: https://doi.org/10.1088/..

3

Computer modeling of single-layer nanocluster formation in ..:

Prüfer, Thomas ; Möller, Wolfhard ; Heinig, Karl-Heinz...
Journal of Applied Physics. 125 (2019) 22 - p. , 2019

Link: https://doi.org/10.1063/..

4

Morphology modification of Si nanopillars under ion irradia..:

Xu, Xiaomo ; Heinig, Karl-Heinz ; Möller, Wolfhard...
Semiconductor Science and Technology. 35 (2019) 1 - p. 015021 , 2019

Link: https://doi.org/10.1088/..

5

Site-controlled formation of single Si nanocrystals in a bu..:

Xu, Xiaomo ; Prüfer, Thomas ; Wolf, Daniel...
Beilstein Journal of Nanotechnology. 9 (2018) - p. 2883-2892 , 2018

Link: https://doi.org/10.3762/..

6

The application of low energy ion scattering spectroscopy (..:

Dittmar, Kornelia ; Triyoso, Dina H. ; Erben, Elke...
Surface and Interface Analysis. 49 (2017) 12 - p. 1175-1186 , 2017

Link: https://doi.org/10.1002/..

7

In-situ study of the TDDB-induced damage mechanism in Cu/ul..:

Liao, Zhongquan ; Gall, Martin ; Yeap, Kong Boon...
Microelectronic Engineering. 137 (2015) - p. 47-53 , 2015

Link: https://doi.org/10.1016/..

8

AES and Related Techniques for Yield Improvement, Metrology..:

Dittmar, Kornelia ; Ohsiek, Susanne ; Klein, Christoph...
Microscopy and Microanalysis. 20 (2014) S3 - p. 2054-2055 , 2014

Link: https://doi.org/10.1017/..

9

Enhanced growth and Cu diffusion barrier properties of ther..:

Wojcik, Henry ; Hossbach, Christoph ; Kubasch, Christoph...
Microelectronic Engineering. 110 (2013) - p. 29-34 , 2013

Link: https://doi.org/10.1016/..

10

Improving Accuracy and Precision of Strain Analysis by Ener..:

Hähnel, Angelika ; Reiche, Manfred ; Moutanabbir, Oussama...
Microscopy and Microanalysis. 18 (2012) 1 - p. 229-240 , 2012

Link: https://doi.org/10.1017/..

11

Elemental mapping of multilayered structures: A method to r..:

Potapov, Pavel ; Engelmann, Hans-Jürgen
Ultramicroscopy. 111 (2011) 12 - p. 1681-1687 , 2011

Link: https://doi.org/10.1016/..

12

Interface Formation in the US-Wedge/Wedge-Bond Process of A..:

Geissler, Ute ; Funck, Jürgen ; Schneider-Ramelow, Martin...
Journal of Electronic Materials. 40 (2010) 2 - p. 239-246 , 2010

Link: https://doi.org/10.1007/..

13

Chemical bonds in damaged and pristine low-κ materials: A c..:

Stegmann, Heiko ; Özdöl, V. Burak ; Koch, Christoph...
Microelectronic Engineering. 85 (2008) 10 - p. 2169-2171 , 2008

Link: https://doi.org/10.1016/..

14

FIB-Präparation und TEM-Analytik an AlSi1-Bondkontakten:

Geißler, Ute ; Engelmann, Hans-Jürgen ; Urban, Ingrid.
Practical Metallography. 43 (2006) 10 - p. 520-533 , 2006

Link: https://doi.org/10.3139/..

15

Effect of interface strength on electromigration-induced in..:

Zschech, Ehrenfried ; Engelmann, Hans-Jürgen ; Meyer, Moritz Andreas...
Zeitschrift für Metallkunde. 96 (2005) 9 - p. 966-971 , 2005

Link: https://doi.org/10.3139/..