Estournès, C.
121  Ergebnisse:
Personensuche X
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2

Scale-Up of Silver–Copper Composite Wires by Spark Plasma S..:

Tardieu, S. ; Béard, J. ; Mesguich, D....
IEEE Transactions on Applied Superconductivity.  34 (2024)  5 - p. 1-4 , 2024
 
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4

Investigation of the mechanical properties of MnSi via EBSD..:

Mejri, M. ; Malard, B. ; Thimont, Y....
Journal of Alloys and Compounds.  900 (2022)  - p. 163458 , 2022
 
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5

Manufacturing and performances of silicide-based thermoelec..:

Ihou Mouko, H. ; Romanjek, K. ; Mejri, M....
Energy Conversion and Management.  242 (2021)  - p. 114304 , 2021
 
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6

Fully coupled electrothermal and mechanical simulation of t..:

Van der Laan, A. ; Epherre, R. ; Chevallier, G....
Journal of the European Ceramic Society.  41 (2021)  7 - p. 4252-4263 , 2021
 
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7

Simple method for the identification of electrical and ther..:

Van der Laan, A. ; Boyer, V. ; Epherre, R..
Journal of the European Ceramic Society.  41 (2021)  1 - p. 599-610 , 2021
 
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8

Thermal stability of Mg2Si0.55Sn0.45 for thermoelectric app..:

Mejri, M. ; Malard, B. ; Thimont, Y....
Journal of Alloys and Compounds.  846 (2020)  - p. 156413 , 2020
 
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15

Finite-element modeling of the electro-thermal contacts in ..:

Manière, C. ; Pavia, A. ; Durand, L....
Journal of the European Ceramic Society.  36 (2016)  3 - p. 741-748 , 2016
 
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