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Eto, Motoki
40  Ergebnisse:
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1

Silver Bonding Wire – An Alternative for Mechanical Sensiti..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Klengel, Robert ; Klengel, Sandy ; Tismer, Sebastian... - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
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2

Investigation of failure mechanism of aluminum-scandium wir..:

Yamaguchi, Tadashi ; Suto, Yuya ; Araki, Noritoshi...
Microelectronics Reliability.  144 (2023)  - p. 114956 , 2023
Link: https://doi.org/10.1016/..
 
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3

Comprehensive Study of Long-Term Reliability of Copper Bond..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Klengel, Robert ; Klengel, Sandy ; Tismer, Sebastian... - p. 489-494 , 2022
Link: https://doi.org/10.1109/..
 
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4

Microstructural characterization of alloyed palladium coate..:

Eto, Motoki ; Araki, Noritoshi ; Yamada, Takashi..
Microelectronics Reliability.  120 (2021)  - p. 114125 , 2021
Link: https://doi.org/10.1016/..
 
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5

Influence of post-bonding heating process on the long-term ..:

Eto, Motoki ; Araki, Noritoshi ; Yamada, Takashi..
Microelectronics Reliability.  118 (2021)  - p. 114058 , 2021
Link: https://doi.org/10.1016/..
 
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6

Influence of Copper Wire Material Additive Elements to the ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Klengel, Robert ; Klengel, Sandy ; Schischka, Jan... - p. 774-781 , 2020
Link: https://doi.org/10.1109/..
 
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7

How Copper Wire Material Additive Elements Effect the Relia..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Klengel, Robert ; Klengel, Sandy ; Petzold, Matthias... - p. 1-7 , 2020
Link: https://doi.org/10.1109/..
 
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8

Investigation of mechanical and microstructural properties ..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Lorenz, Georg ; Naumann, Falk ; Klengel, Robert... - p. 1-6 , 2019
Link: https://doi.org/10.23919..
 
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9

Influence of copper wire material to corrosion resistant pa..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Klengel, Sandy ; Klengel, Robert ; Schischka, Jan... - p. 1-8 , 2019
Link: https://doi.org/10.23919..
 
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10

Synthesis and characterization of mixed-ligand ruthenium(II..:

Hoshino, Yoshimasa ; Eto, Motoki ; Fujino, Taku...
Inorganica Chimica Acta.  357 (2004)  2 - p. 600-604 , 2004
Link: https://doi.org/10.1016/..
 
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11

Synthesis and Spectroelectrochemical Characterization of a ..:

Fujino, Taku ; Hoshino, Yoshimasa ; Eto, Motoki...
Chemistry Letters.  32 (2003)  3 - p. 274-275 , 2003
Link: https://doi.org/10.1246/..
 
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12

Analgesic Effect of Passive Range-of-Motion Exercise on the..:

Eto, Shuichi ; Sonohata, Motoki ; Takei, Yasuo...
Pain Research and Management.  2023 (2023)  - p. 1-7 , 2023
Link: https://doi.org/10.1155/..
 
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13

Fragility fracture following total hip arthroplasty:

Nakayama, Yuhei ; Sonohata, Motoki ; Kitajima, Masaru...
Journal of Orthopaedic Science.  27 (2022)  2 - p. 402-407 , 2022
Link: https://doi.org/10.1016/..
 
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14

Complications of total hip arthroplasty for patients with o..:

Hashimoto, Akira ; Sonohata, Motoki ; Kitajima, Masaru...
Journal of Orthopaedic Science.  27 (2022)  2 - p. 500-503 , 2022
Link: https://doi.org/10.1016/..
 
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15

Periarticular analgesic injection containing a corticostero..:

Hashimoto, Akira ; Sonohata, Motoki ; Hirata, Hirohito...
BMC Musculoskeletal Disorders.  22 (2021)  1 - p. , 2021
Link: https://doi.org/10.1186/..
 
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