Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Ezawa, Hirokazu
6  Ergebnisse:
Personensuche X
?
1

Alloying behaviour of electroplated Ag film with its underl..:

Ezawa, Hirokazu ; Miyata, Masahiro ; Tatsumi, Kohei
Journal of Alloys and Compounds.  587 (2014)  - p. 487-492 , 2014
Link: https://doi.org/10.1016/..
 
?
2

Process integration of fine pitch Cu redistribution wiring ..:

Ezawa, Hirokazu ; Togasaki, Takashi ; Migita, Tatsuo...
Microelectronic Engineering.  103 (2013)  - p. 22-32 , 2013
Link: https://doi.org/10.1016/..
 
?
3

The sprint process of Al interconnects with low-temperature..:

Yoda, Takashi ; Ezawa, Hirokazu ; Tsutsumi, Kaori.
IEICE Electronics Express.  1 (2004)  9 - p. 263-268 , 2004
Link: https://doi.org/10.1587/..
 
?
4

Polymer film deposition with fine pitch openings by stencil..:

Ezawa, Hirokazu ; Seto, Masaharu ; Miyata, Masahiro.
Microelectronics Reliability.  43 (2003)  3 - p. 473-479 , 2003
Link: https://doi.org/10.1016/..
 
?
5

Magnetic properties of metastable bcc and amorphous Fe1−Mo,..:

Sumiyama, Kenji ; Ezawa, Hirokazu ; Nakamura, Yoji
Journal of Physics and Chemistry of Solids.  48 (1987)  3 - p. 255-261 , 1987
Link: https://doi.org/10.1016/..
 
?
6

Vapor quenched Fe-Ti alloys: Formation of amorphous phase, ..:

Nakamura, Yoji ; Sumiyama, Kenji ; Ezawa, Hirokazu
Hyperfine Interactions.  27 (1986)  1-4 - p. 361-364 , 1986
Link: https://doi.org/10.1007/..
 
1-6