Fahim Abdullah
326  Ergebnisse:
Personensuche X
?
 
?
2

Effect of Material Aging on the Reliability of an Automotiv..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Fahim, Abdullah ; Zhang, Ryan ; Mavinkurve, Amar... - p. 2062-2069 , 2024
 
?
4

Analisis Peran Komunikasi Oraganisasi IPNU-IPPNU Ranting Ja..:

Fahim, Abdullah ; Pujianto, Wahyu Eko
Journal of Science and Education Research.  3 (2024)  1 - p. 7-12 , 2024
 
?
5

Analysis of Mechanical Behavior of Hybrid SAC-LTS Joints Un..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chakraborty, Souvik ; Chen, Yaxiong ; Sharma, Gaurav... - p. 506-513 , 2024
 
?
7

The Role of Social Media Entrepreneurship in Overcoming Pos..:

, In: Cases on Social Media and Entrepreneurship; Advances in E-Business Research,
 
?
8

A Continuum Damage Mechanics Approach for the Reliability o..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
?
9

CellIdentifier: Classification of Peripheral Blood Cell Ima..:

, In: 2023 3rd International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME),
 
?
10

Prediction of Stress-Strain Behavior of Thermally Cycled SA..:

, In: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
 
?
11

Comparison of Thermal Cycling Induced Mechanical Property E..:

, In: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
 
?
12

Mechanical Property Evolution in SAC+Bi Lead Free Solders S..:

, In: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
 
?
13

Modeling Deformation Behavior of Multiple Grained SAC305 So..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
 
?
14

Investigation on the Mechanical Behavior Evolution Occurrin..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
 
?
15

Investigation of the Mechanical Behavior of SAC305 Solder J..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
 
1-15