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3D Microelectronic Packaging; Springer Series in Advanced Microelectronics ,
7
Die and Package Level Thermal and Thermal/Moisture Stresses..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
8
A Direct Multi-Field Coupling Methodology for Modeling Mois..:
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2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
13