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Fang, Jen-Kuang
2766  Ergebnisse:
Personensuche X
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1

In Situ Electrical Characterization of Carbon Nanotubes in ..:

Kuo, Yen-Hung ; Fang, Jen-Kuang ; Chen, Jen-Chun...
ACS Applied Nano Materials.  , 2024
Link: https://doi.org/10.1021/..
 
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2

Approach with Large Panel Fan-Out Technology:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Shen, Ping-Ching ; Huang, Sheng-Feng ; Yang, Ping-Feng. - p. 175-176 , 2024
Link: https://doi.org/10.23919..
 
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3

Application of the Taguchi method to minimize the non-unifo..:

Yu, Shun-Hsuan ; Kao, Chuan-Ping ; Ma, Chun-Wei...
Journal of the Taiwan Institute of Chemical Engineers.  156 (2024)  - p. 105379 , 2024
Link: https://doi.org/10.1016/..
 
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4

Using Flexible Hybrid Electronics on a Miniaturized Non-inv..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Yu-Chil ; Yu, Kai-Lun ; Tsai, Shu-An... - p. 201-207 , 2024
Link: https://doi.org/10.1109/..
 
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5

Large Panel Fan-Out Process for High Performance Computing ..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lu, Powei ; Weng, Jia Sang ; Yang, F S.. - p. 67-68 , 2024
Link: https://doi.org/10.23919..
 
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6

Proposed Application Demonstration Based on Commercial Prod..:

, In: 2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE),
Tsao, Yung-Chung ; Shih, Ming-Chang ; Liu, Yi-Yueh.. - p. 698-701 , 2023
Link: https://doi.org/10.1109/..
 
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7

An Effective Uniformity Improvement For Fan-Out Panel Level..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Liao, Chin-Ting ; Wu, Boyin ; Kuo, Mingtzung... - p. 38-41 , 2023
Link: https://doi.org/10.1109/..
 
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8

Electroplating Uniformity Enhancement for High Performance ..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Chiang, Yuan-Feng ; Wu, Boyin ; Kuo, Mingtzung.. - p. 63-64 , 2023
Link: https://doi.org/10.23919..
 
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9

Simulation modeling of 600mm X600mm fan-out panel level for..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Cheng, Kuo-Ching ; Chen, Bo-Heng ; Chen, Cong-Wei... - p. 120-124 , 2023
Link: https://doi.org/10.1109/..
 
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10

Deca & ASE M-Series Bridge Die Compensation & Adaptive Patt..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Sandstrom, Clifford ; Talain, Erick ; Olson, Timothy... - p. 797-803 , 2023
Link: https://doi.org/10.1109/..
 
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11

Novel Feature Extraction Enhances YOLO on FOCoS RDL Recogni..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Fang, Jen-Kuang ; Lu, Wen-Long ; Hung, Chao-Kai.. - p. 168-170 , 2023
Link: https://doi.org/10.1109/..
 
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12

Simulation Modeling of 600mm X600mm Fan-Out Panel Level for..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Cheng, Kuo-Ching ; Chen, Bo-Heng ; Chen, Cong-Wei... - p. 46-49 , 2023
Link: https://doi.org/10.1109/..
 
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13

The physical improvement of copper deposition uniformity wi..:

Ma, Chun-Wei ; Yu, Shun-Hsuan ; Fang, Jen-Kuang..
Journal of Electroanalytical Chemistry.  948 (2023)  - p. 117790 , 2023
Link: https://doi.org/10.1016/..
 
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14

Micro Ball Mount Process for High Performance Fan-Out Large..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Lu, Powei ; Weng, Jia Sang ; Chen, Huang Han.. - p. 65-66 , 2023
Link: https://doi.org/10.23919..
 
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15

Application of Environmental Noise Monitoring System Integr..:

, In: 2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE),
Tsao, Yung-Chung ; Shih, Ming-Chang ; Kuo, Han-Jung.. - p. 149-153 , 2023
Link: https://doi.org/10.1109/..
 
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