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Fang, Jingxun
53  Ergebnisse:
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1

Feasibility Analysis of Skip ILD CMP Scheme on 28nm Technol..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Chen, Fan ; Liu, Zhen ; Zhu, Shaojia... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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2

Incoming Impact on Dishing Improvement in FEOL Process:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Du, Huize ; Liu, Shubin ; Yang, Yu... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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3

Improved Performance of PMOS by Optimizing the Epitaxial Mo..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Wang, Tao ; Chen, Yongyue ; Peng, Li... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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4

Sige Epitaxy Improved by SI Cap Technology:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Wang, Tao ; Chen, Yongyue ; Su, Yingjie... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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5

Dishing Study on Chemical Mechanical Planarization (CMP):

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
DU, Huize ; Liu, Shubin ; Yang, Yu... - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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6

Study on 28NM Technology Node ILD0-CMP Micro_Scratch Defect..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Ma, Xing ; Wang, Kailin ; Yu, Jianwen... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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7

Study on the Mechanism of CMP Induced W Seam at Advanced Te..:

, In: 2023 China Semiconductor Technology International Conference (CSTIC),
Zhu, Shaojia ; Que, Yurong ; Shi, Feng... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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8

Pattern Loading Improvement for CU CMP Process:

, In: 2023 China Semiconductor Technology International Conference (CSTIC),
Zhang, Lei ; Yang, Yu ; Zhang, Jian.. - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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9

An Optimized Method for Cu CMP Dishing Improvement:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),
Zhang, Lei ; Meng, Yuanyuan ; Xian, Yi... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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10

Research on the oxidation behavior of Titanium nitride thin..:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),
Zhang, Xiaotong ; Zeng, Zhaoqin ; Cao, Yanpeng... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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11

Tungsten CMP Consumable Localization Study at 28NM Technolo..:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),
Zhu, Shaojia ; Yu, Mingfei ; Pan, Hongming... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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12

Study on the Correlation Between CMP CU Loading and EDP Cur..:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),
Meng, Yuanyuan ; Yixian ; Zhang, Lei... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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13

Investigation of 14 NM Contact Tungsten Gap-Filling Perform..:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),
Wang, Xiaofang ; Xu, Jiazhang ; Yuan, Zhiqi... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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14

Improvement of CU-CMP EDP Curves for Different Pattern Dens..:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),
Xian, Yi ; Meng, Yuanyuan ; Zhang, Lei... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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15

An Optimized Monitoring Method for 28HK ILDCMP:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),
Li, Jingjing ; Pan, Hongming ; Yu, Mingfei... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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