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Farcy, Alexis
72  Ergebnisse:
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1

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked ..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Vivet, Pascal ; Guthmuller, Eric ; Thonnart, Yvain... - p. 46-48 , 2020
Link: https://doi.org/10.1109/..
 
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2

Co-integration of TSV mid process and optical devices for S..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Tissier, Pierre ; Charbonnier, Jean ; Velard, Remi... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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3

Preface:

Thomas, Olivier ; Farcy, Alexis ; Maitrejean, Sylvain.
Microelectronic Engineering.  156 (2016)  - p. 1 , 2016
Link: https://doi.org/10.1016/..
 
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4

Electromigration-induced failure in operando characterizati..:

Gousseau, Simon ; Moreau, Stéphane ; Bouchu, David...
Microelectronics Reliability.  55 (2015)  8 - p. 1205-1213 , 2015
Link: https://doi.org/10.1016/..
 
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5

MAM 2012 (selected contributions) March 11–14, Grenoble, Fr..:

MAITREJEAN, Sylvain ; FARCY, Alexis ; CHEVOLLEAU, Thierry
Microelectronic Engineering.  107 (2013)  - p. 59-60 , 2013
Link: https://doi.org/10.1016/..
 
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6

Developments of TaN ALD Process for 3D Conformal Coatings:

Brizé, Virginie ; Prieur, Thomas ; Violet, Perrine...
Chemical Vapor Deposition.  17 (2011)  10-12 - p. 284-295 , 2011
Link: https://doi.org/10.1002/..
 
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Integration and Frequency Dependent Parametric Modeling of ..:

Cadix, Lionel ; Fuchs, Christine ; Rousseau, Maxime...
ECS Transactions.  33 (2010)  12 - p. 1-21 , 2010
Link: https://doi.org/10.1149/..
 
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8

Preface:

Chenevier, Bernard ; Farcy, Alexis ; Maîtrejean, Sylvain
Microelectronic Engineering.  87 (2010)  3 - p. 243-244 , 2010
Link: https://doi.org/10.1016/..
 
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9

Intra-chip wireless interconnections based on high performa..:

Triantafyllou, Anna ; Farcy, Alexis ; Benech, Philippe...
Solid-State Electronics.  49 (2005)  9 - p. 1477-1483 , 2005
Link: https://doi.org/10.1016/..
 
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10

Backside cavities for thermal tuning optimization of silico..:

Tissier, Pierre ; Hassan, Karim ; Reboud, Vincent...
info:eu-repo/semantics/altIdentifier/doi/10.1109/ECTC32696.2021.00264.  , 2021
Link: https://hal.science/hal-..
 
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11

Backside cavities for thermal tuning optimization of silico..:

Tissier, Pierre ; Hassan, Karim ; Reboud, Vincent...
info:eu-repo/semantics/altIdentifier/doi/10.1109/ECTC32696.2021.00264.  , 2021
Link: https://hal.science/hal-..
 
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12

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on..:

Vivet, Pascal ; Guthmuller, Eric ; Thonnart, Yvain...
info:eu-repo/semantics/altIdentifier/doi/10.1109/JSSC.2020.3036341.  , 2021
Link: https://hal.archives-ouv..
 
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13

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on..:

Vivet, Pascal ; Guthmuller, Eric ; Thonnart, Yvain...
info:eu-repo/semantics/altIdentifier/doi/10.1109/JSSC.2020.3036341.  , 2021
Link: https://hal.science/hal-..
 
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14

Backside cavities for thermal tuning optimization of silico..:

Tissier, Pierre ; Hassan, Karim ; Reboud, Vincent...
info:eu-repo/semantics/altIdentifier/doi/10.1109/ECTC32696.2021.00264.  , 2021
Link: https://hal.science/hal-..
 
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15

Backside cavities for thermal tuning optimization of silico..:

Tissier, Pierre ; Hassan, Karim ; Reboud, Vincent...
info:eu-repo/semantics/altIdentifier/doi/10.1109/ECTC32696.2021.00264.  , 2021
Link: https://hal.science/hal-..
 
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