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Fenouillet-Beranger, Claire
107  Ergebnisse:
Personensuche X
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1

A BIMOS-based 2T1C analogue spiking neuron circuit integrat..:

Bédécarrats, Thomas ; Fenouillet-Béranger, Claire ; Cristoloveanu, Sorin.
Solid-State Electronics.  168 (2020)  - p. 107717 , 2020
Link: https://doi.org/10.1016/..
 
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2

Investigation of built-in bipolar junction transistor in FD..:

Bédécarrats, Thomas ; Galy, Philippe ; Fenouillet-Béranger, Claire.
Solid-State Electronics.  159 (2019)  - p. 177-183 , 2019
Link: https://doi.org/10.1016/..
 
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3

Thin film BIMOS transistor for low-power spiking neuron des..:

, In: 2019 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS),
Galy, Philippe ; Bedecarrats, Thomas ; Fenouillet-Beranger, Claire. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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4

Ultraviolet Nanosecond Laser Annealing for Low Temperature ..:

Kerdilès, Sébastien ; Acosta-Alba, Pablo ; Royet, Anne-Sophie...
ECS Transactions.  93 (2019)  1 - p. 19-22 , 2019
Link: https://doi.org/10.1149/..
 
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5

(Invited)3D Monolithic Integration:

Brunet, Laurent ; Batude, Perrine ; Fenouillet-Beranger, Claire.
ECS Transactions.  85 (2018)  8 - p. 125-130 , 2018
Link: https://doi.org/10.1149/..
 
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6

Role of synaptic variability in resistive memory-based spik..:

Ly, Denys R B ; Grossi, Alessandro ; Fenouillet-Beranger, Claire...
Journal of Physics D: Applied Physics.  51 (2018)  44 - p. 444002 , 2018
Link: https://doi.org/10.1088/..
 
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7

(Invited) Sequential 3D Process Integration: Opportunities ..:

Kerdilès, Sébastien ; Acosta-Alba, Pablo ; Mathieu, Benoit...
ECS Transactions.  80 (2017)  4 - p. 215-225 , 2017
Link: https://doi.org/10.1149/..
 
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8

Dielectrics stability for intermediate BEOL in 3D sequentia..:

Deprat, Fabien ; Fenouillet-Beranger, Claire ; Jousseaume, Vincent...
Microelectronic Engineering.  167 (2017)  - p. 90-94 , 2017
Link: https://doi.org/10.1016/..
 
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9

Integration of Low Temperature SiGe:B Raised Sources and Dr..:

Lu, Cao-Minh Vincent ; Fenouillet-Beranger, Claire ; Hartmann, Jean-Michel...
ECS Transactions.  75 (2016)  8 - p. 51-58 , 2016
Link: https://doi.org/10.1149/..
 
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10

From 2D to Monolithic 3D : Design Possibilities, Expecta..:

, In: Proceedings of the 2015 Symposium on International Symposium on Physical Design,
Billoint, Olivier ; Sarhan, Hossam ; Rayane, Iyad... - p. 127 ff. , 2015
Link: https://dl.acm.org/doi/1..
 
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11

(Invited) Direct Bonding: A Key Enabler for 3D Monolithic I..:

Brunet, Laurent ; Batude, Perrine ; Fournel, Frank...
ECS Transactions.  64 (2014)  5 - p. 381-390 , 2014
Link: https://doi.org/10.1149/..
 
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12

Z2-FET: A promising FDSOI device for ESD protection:

Solaro, Yohann ; Wan, Jing ; Fonteneau, Pascal...
Solid-State Electronics.  97 (2014)  - p. 23-29 , 2014
Link: https://doi.org/10.1016/..
 
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13

Study of substrate orientations impact on Ultra Thin Buried..:

Ben Akkez, Imed ; Fenouillet-Beranger, Claire ; Cros, Antoine...
Solid-State Electronics.  90 (2013)  - p. 143-148 , 2013
Link: https://doi.org/10.1016/..
 
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14

New parameter extraction method based on split C–V measurem..:

Ben Akkez, Imed ; Cros, Antoine ; Fenouillet-Beranger, Claire...
Solid-State Electronics.  84 (2013)  - p. 142-146 , 2013
Link: https://doi.org/10.1016/..
 
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15

Characterization and modeling of capacitances in FD-SOI dev..:

Ben Akkez, Imed ; Cros, Antoine ; Fenouillet-Beranger, Claire...
Solid-State Electronics.  71 (2012)  - p. 53-57 , 2012
Link: https://doi.org/10.1016/..
 
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