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Field, Daniel E.
~ 4100  Ergebnisse:
Personensuche X
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1

Evaluating the interfacial toughness of GaN-on-diamond with..:

Field, Daniel E. ; Beale, Ryan ; Getzler, Naomi...
Scripta Materialia.  209 (2022)  - p. 114370 , 2022
Link: https://doi.org/10.1016/..
 
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2

Thermal characterization of direct wafer bonded Si-on-SiC:

Field, Daniel E. ; Pomeroy, James W. ; Gity, Farzan...
Applied Physics Letters.  120 (2022)  11 - p. , 2022
Link: https://doi.org/10.1063/..
 
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3

Record-Low Thermal Boundary Resistance between Diamond and ..:

Malakoutian, Mohamadali ; Field, Daniel E. ; Hines, Nicholas J....
ACS Applied Materials & Interfaces.  13 (2021)  50 - p. 60553-60560 , 2021
Link: https://doi.org/10.1021/..
 
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4

Thermal stress modelling of diamond on GaN/III-Nitride memb..:

Cuenca, Jerome A. ; Smith, Matthew D. ; Field, Daniel E....
Carbon.  174 (2021)  - p. 647-661 , 2021
Link: https://doi.org/10.1016/..
 
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5

Crystalline Interlayers for Reducing the Effective Thermal ..:

Field, Daniel E. ; Cuenca, Jerome A. ; Smith, Matthew...
ACS Applied Materials & Interfaces.  12 (2020)  48 - p. 54138-54145 , 2020
Link: https://doi.org/10.1021/..
 
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6

Thermal characterization of direct wafer bonded Si-on-SiC:

Field, Daniel E ; Pomeroy, James W ; Gity, Farzan...
Field , D E , Pomeroy , J W , Gity , F , Schmidt , M , Torchia , P , Li , F , Gammon , P , Shah , V A & Kuball , M H H 2022 , ' Thermal characterization of direct wafer bonded Si-on-SiC ' , Applied Physics Letters , vol. 120 , no. 11 , 113503 . https://doi.org/10.1063/5.0080668.  , 2022
Link: https://hdl.handle.net/1..
 
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7

Thermal stress modelling of diamond on GaN/III-Nitride memb..:

Cuenca, Jerome A ; Smith, Matthew D ; Field, Daniel E...
http://arxiv.org/abs/2102.09664.  , 2021
Link: http://arxiv.org/abs/210..
 
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8

Record-Low Thermal Boundary Resistance between Diamond and ..:

Malakoutian, Mohamadali ; Field, Daniel E ; Hines, Nicholas J...
Malakoutian , M , Field , D E , Hines , N J , Pasayat , S , Graham , S , Kuball , M & Chowdhury , S 2021 , ' Record-Low Thermal Boundary Resistance between Diamond and GaN-on-SiC for Enabling Radiofrequency Device Cooling ' , ACS Applied Materials & Interfaces , vol. 13 , pp. 60553-60560 . https://doi.org/10.1021/acsami.1c13833.  , 2021
Link: https://hdl.handle.net/1..
 
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9

GaN-on-diamond technology platform: bonding-free membrane m..:

Smith, Matthew D ; Cuenca, Jerome A ; Field, Daniel E...
http://eprints.gla.ac.uk/211525/1/211525.pdf.  , 2020
Link: http://eprints.gla.ac.uk..
 
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10

GaN-on-diamond technology platform : bonding-free membrane ..:

Smith, Matthew D ; Cuenca, Jerome A ; Field, Daniel E...
https://strathprints.strath.ac.uk/71547/7/Smith_etal_AIPA2020_GaN_on_diamond_technology_platform_bonding_free_membrane_manufacturing_process.pdf.  , 2020
Link: https://strathprints.str..
 
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11

Thermal boundary resistance of direct van der Waals bonded ..:

May, Paul W ; Waller, Will M ; Pomeroy, James W...
May , P W , Waller , W M , Pomeroy , J W , Field , D E , Smith , E & Kuball , M H H 2020 , ' Thermal boundary resistance of direct van der Waals bonded GaN-on-diamond ' , Semiconductor Science and Technology , vol. 35 , 095021 . https://doi.org/10.1088/1361-6641/ab9d35.  , 2020
Link: https://hdl.handle.net/1..
 
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12

GaN-on-diamond technology platform:Bonding-free membrane ma..:

Smith, Matthew D ; Field, Daniel E ; Yuan, Chao...
Smith , M D , Field , D E , Yuan , C , Pomeroy , J W , Uren , M J , Kuball , M H H & al. , E 2020 , ' GaN-on-diamond technology platform : Bonding-free membrane manufacturing process ' , AIP Advances , vol. 10 , no. 3 , 035306 . https://doi.org/10.1063/1.5129229.  , 2020
Link: https://hdl.handle.net/1..
 
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13

Mixed-Size Diamond Seeding for Low-Thermal-Barrier Growth o..:

Smith, Ed ; Piracha, A.H ; Field, Daniel E...
Smith , E , Piracha , A H , Field , D E , Pomeroy , J W , Mackenzie , G R , Abdallah , Z , Massabuau , F C P , Hinz , A , Wallis , DJ , Oliver , R A , Kuball , M H H & May , P W 2020 , ' Mixed-Size Diamond Seeding for Low-Thermal-Barrier Growth of CVD Diamond onto GaN and AlN ' , Carbon , vol. 167 , pp. 620-626 . https://doi.org/10.1016/j.carbon.2020.05.050.  , 2020
Link: https://hdl.handle.net/1..
 
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14

Thermal stress modelling of diamond on GaN/III-Nitride memb..:

Cuenca, Jerome A ; Smith, Matthew D ; Field, Daniel E...
https://strathprints.strath.ac.uk/74786/1/Cuenca_etal_Carbon_2020_Thermal_stress_modelling_of_diamond_on_GaN_III_Nitride.pdf.  , 2020
Link: https://strathprints.str..
 
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15

Thermal stress modelling of diamond on GaN/III-Nitride memb..:

Cuenca, Jerome A ; Smith, Matthew D ; Field, Daniel E...
Cuenca , J A , Smith , M D , Field , D E , Massabuau , F C-P , Mandal , S , Pomeroy , J W , Wallis , D J , Oliver , R A , Thayne , I , Kuball , M & Williams , O A 2015 , ' Thermal stress modelling of diamond on GaN/III-Nitride membranes ' , Carbon , vol. 174 , pp. 647-661 . https://doi.org/10.1016/j.carbon.2020.11.067.  , 2015
Link: https://hdl.handle.net/1..
 
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