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Fournel, Frank
126  Ergebnisse:
Personensuche X
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1

Fine pitch Nb-Nb Direct Bonding for quantum applications:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Renaud, Pablo ; Dubarry, Christophe ; Bresson, Nicolas... - p. 441-446 , 2024
Link: https://doi.org/10.1109/..
 
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2

Copper Microstructure Optimization for Fine Pitch Low Tempe..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Maubert, Marie ; Gottardi, Mathilde ; Philip, Pierre-Emile... - p. 631-636 , 2024
Link: https://doi.org/10.1109/..
 
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3

Soft Surface Activated Bonding of Hydrophobic Silicon Subst..:

Lomonaco, Quentin ; Abadie, Karine ; Hartmann, Jean-Michel...
ECS Transactions.  112 (2023)  3 - p. 139-145 , 2023
Link: https://doi.org/10.1149/..
 
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4

Edge Bonding Voids Management Using Humid Helium Bonding At..:

Fournel, Frank ; Larrey, Vincent ; Morales, Christophe.
ECS Transactions.  112 (2023)  3 - p. 15-22 , 2023
Link: https://doi.org/10.1149/..
 
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5

Large-scale controlled coupling of single-photon emitters t..:

Humbert, Mélodie ; Hernandez, Romain ; Mallet, Nicolas...
Nanoscale.  15 (2023)  2 - p. 599-608 , 2023
Link: https://doi.org/10.1039/..
 
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6

Vacuum Quality Impact on Covalent Bonding:

Abadie, Karine ; Lomonaco, Quentin ; Michaud, Laurent..
ECS Transactions.  112 (2023)  3 - p. 125-137 , 2023
Link: https://doi.org/10.1149/..
 
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7

Nanosecond Laser Irradiation for Interface Bonding Characte..:

Larrey, Vincent ; Arribehaute, Arthur ; Caulfield, Brendon...
ECS Transactions.  112 (2023)  3 - p. 39-49 , 2023
Link: https://doi.org/10.1149/..
 
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8

Single SiGe Quantum Dot Emission Deterministically Enhanced..:

Poempool, Thanavorn ; Aberl, Johannes ; Clementi, Marco...
Optics Express.  , 2023
Link: https://doi.org/10.1364/..
 
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9

Infrared Spectroscopy Study of Edge Water Penetration at Hy..:

Noël, Paul ; Larrey, Vincent ; Morales, Christophe...
ECS Transactions.  112 (2023)  3 - p. 31-37 , 2023
Link: https://doi.org/10.1149/..
 
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10

Integration And Process Challenges Of Self Assembly Applied..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Bourjot, Emilie ; Bond, Alice ; Nadi, Noura... - p. 1397-1402 , 2023
Link: https://doi.org/10.1109/..
 
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11

SAB-Enabled Room Temperature Hybrid Bonding:

Renaud, Pablo ; Abadie, Karine ; Fournel, Frank...
ECS Transactions.  112 (2023)  3 - p. 83-94 , 2023
Link: https://doi.org/10.1149/..
 
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12

Inline Bondwave Monitoring for Direct Bonding, Process Opti..:

Michaud, Laurent Gaëtan ; Fournel, Frank ; Morales, Christophe...
ECS Transactions.  112 (2023)  3 - p. 23-30 , 2023
Link: https://doi.org/10.1149/..
 
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13

High Cleanliness and High Hydrophobic/Hydrophilic Contrast ..:

Montméat, Pierre ; Enot, Thierry ; Bond, Alice...
ECS Transactions.  112 (2023)  3 - p. 181-190 , 2023
Link: https://doi.org/10.1149/..
 
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14

Polymer to Silicon Direct Bonding for Microelectronics:

Dautriat, Margaux ; Montméat, Pierre ; Fournel, Frank
ECS Transactions.  112 (2023)  3 - p. 51-62 , 2023
Link: https://doi.org/10.1149/..
 
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15

(Invited) Hybrid Bonding for 3D Applications: Improvements ..:

Deloffre, Emilie ; Ayoub, Bassel ; Lhostis, Sandrine...
ECS Transactions.  112 (2023)  3 - p. 63-72 , 2023
Link: https://doi.org/10.1149/..
 
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