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X
Fros, Denis
20  Ergebnisse:
Personensuche X
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1

Solderless Component Assembly: Novel Ecological Approach to..:

, In: 2023 46th International Spring Seminar on Electronics Technology (ISSE),
Vesely, Petr ; Zdrahal, Jakub ; Kralova, Iva.. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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2

Effect of Incorporation of Ceramic Nanoparticles in Bismuth..:

, In: 2023 46th International Spring Seminar on Electronics Technology (ISSE),
Vesely, Petr ; Fros, Denis ; Klimtova, Marketa.. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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3

Dielectric spectroscopy of PETG/TiO2composite intended for ..:

Veselý, Petr ; Froš, Denis ; Hudec, Tomáš...
Virtual and Physical Prototyping.  18 (2023)  1 - p. , 2023
Link: https://doi.org/10.1080/..
 
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4

Conductive FDM Filament: Electrical Resistivity Assessment ..:

, In: 2023 46th International Spring Seminar on Electronics Technology (ISSE),
Fros, Denis ; Kralova, Iva - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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5

A Weakness of Wetting Balance Method during the Diagnostic ..:

, In: 2022 45th International Spring Seminar on Electronics Technology (ISSE),
Dusek, Karel ; Vesely, Petr ; Fros, Denis... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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6

Latent heat induced deformation of PCB substrate: Measureme..:

Froš, Denis ; Veselý, Petr ; Zemen, Jan.
Case Studies in Thermal Engineering.  36 (2022)  - p. 102173 , 2022
Link: https://doi.org/10.1016/..
 
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7

Toward reducing no-clean flux spatter during reflow solderi..:

Veselý, Petr ; Dušek, Karel ; Froš, Denis
Journal of Manufacturing Processes.  81 (2022)  - p. 696-706 , 2022
Link: https://doi.org/10.1016/..
 
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8

Electrochemical Migration Issues Related to Improper Solder..:

, In: 2022 45th International Spring Seminar on Electronics Technology (ISSE),
Vesely, Petr ; Klimtova, Marketa ; Fros, Denis - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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9

Thermomechanical Assessment of Novel Composites Intended fo..:

, In: 2022 45th International Spring Seminar on Electronics Technology (ISSE),
Fros, Denis ; Vesely, Petr - p. 1-8 , 2022
Link: https://doi.org/10.1109/..
 
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10

Biodegradable and Nanocomposite Materials as Printed Circui..:

Geczy, Attila ; Farkas, Csaba ; Kovacs, Rebeka...
IEEE Open Journal of Nanotechnology.  3 (2022)  - p. 182-190 , 2022
Link: https://doi.org/10.1109/..
 
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11

Investigation of Impacts on Printed Circuit Board Laminated..:

Froš, Denis ; Dušek, Karel ; Veselý, Petr
Polymers.  13 (2021)  19 - p. 3203 , 2021
Link: https://doi.org/10.3390/..
 
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12

Evaluation of Long-term Stability of Bismuth-Tin Solder Joi..:

, In: 2021 44th International Spring Seminar on Electronics Technology (ISSE),
Vesely, Petr ; Fros, Denis - p. 1-7 , 2021
Link: https://doi.org/10.1109/..
 
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13

Workplace for Demonstration of Electrochemical Migration Ef..:

, In: 2021 44th International Spring Seminar on Electronics Technology (ISSE),
Dusek, Karel ; Vesely, Petr ; Kozak, Martin... - p. 1-5 , 2021
Link: https://doi.org/10.1109/..
 
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14

Bond Strength Test of Soldering Pads with Various Surface F..:

, In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE),
Fros, Denis ; Dusek, Karel - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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15

Investigation of Impacts on Printed Circuit Board Laminated..:

Froš, Denis ; Dušek, Karel ; Veselý, Petr
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC8512263/.  , 2021
Link: http://www.ncbi.nlm.nih...
 
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