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Fujino, Masahisa
42  Ergebnisse:
Personensuche X
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1

Interface Analysis of Direct Bonded Oxide Layers by Neutron..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Fujino, Masahisa ; Takahashi, Kenji ; Kikuchi, Katsuya. - p. 97-98 , 2024
Link: https://doi.org/10.23919..
 
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2

Multi Die Stacked Structure Fabricated by WoW Bonding:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),
Shimamoto, Haruo ; Araga, Yuuki ; Fujino, Masahisa... - p. 65-68 , 2023
Link: https://doi.org/10.1109/..
 
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3

Nb–Nb direct bonding at room temperature for superconductin..:

Fujino, Masahisa ; Araga, Yuuki ; Nakagawa, Hiroshi...
Journal of Applied Physics.  133 (2023)  1 - p. , 2023
Link: https://doi.org/10.1063/..
 
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4

Nb-Nb Direct Bonding Pads for Superconducting Devices and T..:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),
Kudo, Atsushi ; Fujino, Masahisa ; Nakagawa, Hiroshi... - p. 25-28 , 2023
Link: https://doi.org/10.1109/..
 
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5

Interfacial Analysis of Plasma Fusion Bonded Interfaces Und..:

Fujino, Masahisa ; Takahashi, Kenji ; Kikuchi, Katsuya...
ECS Transactions.  98 (2020)  4 - p. 11-16 , 2020
Link: https://doi.org/10.1149/..
 
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6

Interconnect Fabrication on Polymer Substrate using Submicr..:

Huang, Guo-Lun ; Chiu, Po-Hsiang ; Fujino, Masahisa.
JOM.  71 (2019)  9 - p. 3057-3065 , 2019
Link: https://doi.org/10.1007/..
 
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7

300 mm wafer-level hybrid bonding for Cu/interlayer dielect..:

Fujino, Masahisa ; Takahashi, Kenji ; Araga, Yuuki.
Japanese Journal of Applied Physics.  59 (2019)  SB - p. SBBA02 , 2019
Link: https://doi.org/10.7567/..
 
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8

Room temperature bonding and debonding of polyimide film an..:

Takeuchi, Kai ; Fujino, Masahisa ; Matsumoto, Yoshiie.
Japanese Journal of Applied Physics.  57 (2018)  2S1 - p. 02BB05 , 2018
Link: https://doi.org/10.7567/..
 
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9

Low temperature de-oxidation for copper surface by catalyze..:

Chou, Pei-Wen ; Song, Jenn-Ming ; Xie, Zong-Yu...
Applied Surface Science.  456 (2018)  - p. 890-898 , 2018
Link: https://doi.org/10.1016/..
 
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10

Mechanism of bonding and debonding using surface activated ..:

Takeuchi, Kai ; Fujino, Masahisa ; Matsumoto, Yoshiie.
Japanese Journal of Applied Physics.  57 (2018)  4S - p. 04FC11 , 2018
Link: https://doi.org/10.7567/..
 
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11

Reduction reaction analysis of nanoparticle copper oxide fo..:

Fujino, Masahisa ; Akaike, Masatake ; Matsuoka, Naoya.
Japanese Journal of Applied Physics.  56 (2017)  4S - p. 04CC01 , 2017
Link: https://doi.org/10.7567/..
 
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12

Bonding and transferring of carbon nanotube bumps using mag..:

Fujino, Masahisa ; Terasaka, Hidenori ; Suga, Tadatomo
Japanese Journal of Applied Physics.  57 (2017)  2S1 - p. 02BC02 , 2017
Link: https://doi.org/10.7567/..
 
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13

GaN-Si direct wafer bonding at room temperature for thin Ga..:

Mu, Fengwen ; Morino, Yuki ; Jerchel, Kathleen..
Applied Surface Science.  416 (2017)  - p. 1007-1012 , 2017
Link: https://doi.org/10.1016/..
 
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14

Preparation of pine-like Cu-Ni-P coating and its applicatio..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Wenjing ; Wang, Yinghui ; Suga, Tadatomo... - p. 54-58 , 2017
Link: https://doi.org/10.1109/..
 
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15

Combined surface activated bonding using H-containing HCOOH..:

He, Ran ; Fujino, Masahisa ; Akaike, Masatake...
Applied Surface Science.  414 (2017)  - p. 163-170 , 2017
Link: https://doi.org/10.1016/..
 
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