E-LIB Suche - Ergebnisse für: Gan, C.L.

1

Is routine gastrointestinal endoscopy required in every wom..:

Katsanevakis, E. ; Addo-Yobo, W. ; Bharathan, B....
European Journal of Obstetrics & Gynecology and Reproductive Biology. 294 (2024) - p. 105-110 , 2024

Link: https://doi.org/10.1016/..

2

Investigation on memory package crack and prevention under ..:

Che, Fa Xing ; Ong, Yeow Chon ; Ng, Hong Wan..
Materials Science in Semiconductor Processing. 180 (2024) - p. 108560 , 2024

Link: https://doi.org/10.1016/..

3

WCN23-0305 ANCA ASSOCIATED GLOMERULONEPHRITIS IN A TERTIARY..:

Yee Wan, L. ; Hing Wong, A. ; Lim, S.E....
Kidney International Reports. 8 (2023) 3 - p. S61-S62 , 2023

Link: https://doi.org/10.1016/..

4

Pyruvate carboxylase deficiency type C; variable presentati..:

Bernhardt, I. ; Van Dorp, L. ; Dixon, M....
JIMD Reports. 65 (2023) 1 - p. 10-16 , 2023

Link: https://doi.org/10.1002/..

5

WCN23-0409 USING SERUM BETA-TRACED PROTEIN TO ESTIMATE RESI..:

ANG, B.H. ; Gan, C.C. ; Lim, S.K.
Kidney International Reports. 8 (2023) 3 - p. S423 , 2023

Link: https://doi.org/10.1016/..

6

WCN23-0318 IMPACT OF COVID VACCINATION ON HOSPITALIZED COVI..:

OOI, S. ; Ng, K.P. ; Sthaneshwar, P....
Kidney International Reports. 8 (2023) 3 - p. S458 , 2023

Link: https://doi.org/10.1016/..

7

Investigation on Data Retrieval in Emerging Non-Volatile Me..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),

Tay, J. Y. ; Cheah, J. ; Chef, S.... - p. 1-6 , 2023

Link: https://doi.org/10.1109/..

8

WCN23-0401 PREDICTING HIGH-RISK PATIENTS USING THE INTERNAT..:

ROZI, N.R.B. ; Ting, H.C. ; Wong, Z.S....
Kidney International Reports. 8 (2023) 3 - p. S65-S66 , 2023

Link: https://doi.org/10.1016/..

9

Ruggedized sensor packaging with advanced die attach and en..:

Tay, Y.S. ; Yang, L. ; Zhang, H....
Microelectronics Reliability. 150 (2023) - p. 115115 , 2023

Link: https://doi.org/10.1016/..

10

Investigation of the role of pre-existing oxide in the init..:

Tan, H.T. ; Gao, Y. ; Syaranamual, G.J....
Microelectronics Reliability. 150 (2023) - p. 115165 , 2023

Link: https://doi.org/10.1016/..

11

The adjacent Fe oxidation greatly enhancing OER activity on..:

Gan, C. ; Jiang, Q. ; Wu, X..
Materials Today Chemistry. 27 (2023) - p. 101330 , 2023

Link: https://doi.org/10.1016/..

12

Hardware Security Assessment through Repair of Damaged Devi..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),

Sim, S. Y. ; Liu, Q. ; Kor, H. B.. - p. 1-5 , 2023

Link: https://doi.org/10.1109/..

13

A review on future novel interconnect and polymeric materia..:

Gan, C. L. ; Huang, Chen Yu ; Zou, Yung Sheng..
Journal of Materials Science: Materials in Electronics. 34 (2023) 29 - p. , 2023

Link: https://doi.org/10.1007/..

14

CO93 Powered Stapling System with Gripping Surface Technolo..:

Gan, C ; Zeng, F ; Cong, W..
Value in Health. 25 (2022) 7 - p. S321 , 2022

Link: https://doi.org/10.1016/..

15

Temperature Cycling Performance of Bi-doped Solder Ball All..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),

Zou, Y. S. ; Chung, M. H. ; Gan, C. L.... - p. 567-569 , 2022

Link: https://doi.org/10.1109/..