E-LIB Suche - Ergebnisse für: Gan, Chong Leong

1

Interconnect Reliability in Advanced Memory Device Packagin..:

Gan, Chong Leong ; Huang, Chen-Yu
Journal of Adhesion Science and Technology. , 2024

2

Solder joint reliability performance study and shear charac..:

Liu, Vance ; Zou, Yung-Sheng ; Chen, Yi-Yu...
Materials Science in Semiconductor Processing. 179 (2024) - p. 108489 , 2024

Link: https://doi.org/10.1016/..

3

Creep Viscoplastic Characterization of SAC Solders Exposed ..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),

Liu, Vance ; Lin, Sih-Tung ; Chang, Esan.. - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

4

Evolution of epoxy molding compounds and future carbon mate..:

Gan, Chong Leong ; Chung, Min-Hua ; Lin, Lu-Fu..
Journal of Materials Science: Materials in Electronics. 34 (2023) 30 - p. , 2023

Link: https://doi.org/10.1007/..

5

Thin Die Flip Chip Process Enablement for Stacked IC Memory..:

, In: 2023 International Conference on Electronics Packaging (ICEP),

Huang, Chen-Yu ; Lee, Jungbae ; Chiang, Tsung-Han... - p. 51-52 , 2023

Link: https://doi.org/10.23919..

6

Reliability Simulation and Modeling in Memory Packaging:

, In: Springer Series in Reliability Engineering; Interconnect Reliability in Advanced Memory Device Packaging,

Gan, Chong Leong, ; Huang, Chen-Yu, - p. 153-184 , 2023

Link: https://doi.org/10.1007/..

7

Recycling of Noble Metals Used in Memory Packaging:

, In: Springer Series in Reliability Engineering; Interconnect Reliability in Advanced Memory Device Packaging,

Gan, Chong Leong, ; Huang, Chen-Yu, - p. 45-66 , 2023

Link: https://doi.org/10.1007/..

8

Second Level Interconnect Reliability of Low Temperature So..:

, In: Springer Series in Reliability Engineering; Interconnect Reliability in Advanced Memory Device Packaging,

Gan, Chong Leong, ; Huang, Chen-Yu, - p. 95-117 , 2023

Link: https://doi.org/10.1007/..

9

Interconnect Reliability in Advanced Memory Device Packagin

Springer Series in Reliability Engineering

Gan, Chong Leong ; Huang, Chen-Yu - 1st ed. 2023 . , 2023

Link: https://doi.org/10.1007/..

10

Flip Chip Process Enablement in IC Memory Stacked Die Packa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Huang, Chen-Yu ; Chiang, Tsung-Han ; Lee, Jungbae... - p. 283-288 , 2023

Link: https://doi.org/10.1109/..

11

The Discriminants of Long and Short Duration Failures in Fu..:

Mutemi, Abed ; Bacao, Fernando ; Gan, Chong Leong
Journal of Engineering. 2023 (2023) - p. 1-10 , 2023

Link: https://doi.org/10.1155/..

12

Advanced Flip Chip Packaging:

, In: Springer Series in Reliability Engineering; Interconnect Reliability in Advanced Memory Device Packaging,

Gan, Chong Leong, ; Huang, Chen-Yu, - p. 67-94 , 2023

Link: https://doi.org/10.1007/..

13

Design Sustainability for Battery Packaging to Increase Cus..:

Adriyanti, Aissyah Lathifah ; Sahroni, Taufik Roni ; Gan, Chong Leong
Journal of Engineering. 2023 (2023) - p. 1-12 , 2023

Link: https://doi.org/10.1155/..

14

Interconnects Reliability for Future Cryogenic Memory Appli..:

, In: Springer Series in Reliability Engineering; Interconnect Reliability in Advanced Memory Device Packaging,

Gan, Chong Leong, ; Huang, Chen-Yu, - p. 185-207 , 2023

Link: https://doi.org/10.1007/..

15

Technological sustainable materials and enabling in semicon..:

Gan, Chong Leong ; Chung, Min-Hua ; Zou, Yung-Sheng..
e-Prime - Advances in Electrical Engineering, Electronics and Energy. 5 (2023) - p. 100245 , 2023

Link: https://doi.org/10.1016/..