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Gao, Li-Yin
84419  Ergebnisse:
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1

Micro-cones Cu fabricated by pulse electrodeposition for so..:

Zhang, Minghui ; Gao, Li-Yin ; Wang, Yu-Xi...
Applied Surface Science.  650 (2024)  - p. 159184 , 2024
Link: https://doi.org/10.1016/..
 
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2

The mechanical property and microstructural thermal stabili..:

Zhang, Yu-Bo ; Gao, Li-Yin ; Tao, Jun-Lei...
Materials Today Communications.  38 (2024)  - p. 108182 , 2024
Link: https://doi.org/10.1016/..
 
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3

Significant inhibition of interfacial Cu6Sn5 IMC and improv..:

Lu, Xiao ; Zhang, Liang ; Liu, Zhi-Quan...
Materials Characterization.  208 (2024)  - p. 113668 , 2024
Link: https://doi.org/10.1016/..
 
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4

Extremely Low Contact Resistivity of Bi2Te3-Based Modules E..:

Min, Erbiao ; Ling, Yifeng ; Zhao, Linghao...
ACS Applied Materials & Interfaces.  15 (2023)  50 - p. 59066-59074 , 2023
Link: https://doi.org/10.1021/..
 
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5

Study on the dual inhibition behavior of interfacial IMCs i..:

Lu, Xiao ; Zhang, Liang ; Guo, Yong-huan...
Journal of Materials Research and Technology.  25 (2023)  - p. 3754-3767 , 2023
Link: https://doi.org/10.1016/..
 
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6

Characterization of Cu-Cu direct bonding in ambient atmosph..:

Zhang, Minghui ; Gao, Li-Yin ; Li, Jun-Jie..
Materials Chemistry and Physics.  306 (2023)  - p. 128089 , 2023
Link: https://doi.org/10.1016/..
 
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7

Prospective application of nanotwinned copper for Damascene..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Gao, Li-Yin ; Wan, Yong-Qiang ; Lei, Zhi-Gang... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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8

Synthesis of Cu Nanowires by Template Electrodeposition and..:

Meng, Zhi-Chao ; Gao, Li-Yin ; Liu, Zhi-Quan
Journal of Electronic Materials.  52 (2023)  5 - p. 3463-3471 , 2023
Link: https://doi.org/10.1007/..
 
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9

Effects of additive interactions on electroplating profile ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Li, Xiao ; Li, Zhe ; Gao, Li-Yin.. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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10

The influence of pattern size on the profile and microstruc..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Jin-Hao ; Gao, Li-Yin ; Cui, Xian-Wei.. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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11

Research Progress of Electroplated Nanotwinned Copper in Mi..:

Chen, Ke-Xin ; Gao, Li-Yin ; Li, Zhe..
Materials.  16 (2023)  13 - p. 4614 , 2023
Link: https://doi.org/10.3390/..
 
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12

Copper electroplating of through silicon vias (TSV) using a..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Chen, Ke-Xin ; Gao, Li-Yin ; Sun, Rong. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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13

Detrimental angle range between c axis of Sn crystal and el..:

Li, Xiao ; Gao, Li-Yin ; Tao, Jun-Lei..
Journal of Materials Science: Materials in Electronics.  33 (2022)  22 - p. 17877-17887 , 2022
Link: https://doi.org/10.1007/..
 
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14

Thermal stability of electroplated Cu films with different ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Minghui ; Gao, Li-Yin ; Wang, Yu-Xi... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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15

Effect of pulse off time on microstructure and properties o..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Yu-Xi ; Gao, Li-Yin ; Wan, Yong-Qiang.. - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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