E-LIB Suche - Ergebnisse für: Ge, Mengran

1

Modeling of electroplated diamond wire and its application ..:

Ge, Mengran ; Zhang, Chenzheng ; Wang, Peizhi..
Journal of Manufacturing Processes. 87 (2023) - p. 141-149 , 2023

Link: https://doi.org/10.1016/..

2

Effect of a liquid bridge on the dynamic behavior of diamon..:

Zheng, Jintao ; Ge, Mengran ; Ge, Peiqi..
Journal of Manufacturing Processes. 94 (2023) - p. 578-591 , 2023

Link: https://doi.org/10.1016/..

3

Effect of liquid bridge on the thickness deviation between ..:

Zheng, Jintao ; Ge, Mengran ; Ge, Peiqi...
Journal of Manufacturing Processes. 108 (2023) - p. 268-279 , 2023

Link: https://doi.org/10.1016/..

4

Machine vision-based transverse vibration measurement of di..:

Zheng, Jintao ; Zhao, Yukang ; Ge, Mengran..
Precision Engineering. 80 (2023) - p. 115-126 , 2023

Link: https://doi.org/10.1016/..

5

Experimental and numerical study on heat transfer enhanceme..:

Duan, Derong ; Cheng, Yujun ; Ge, Mengran...
Applied Thermal Engineering. 207 (2022) - p. 118171 , 2022

Link: https://doi.org/10.1016/..

6

Fabrication of Cylindrical Microlens Array on RB-SiC Moulds..:

Su, Fukang ; Zhang, Zhenzhong ; Yao, Peng...
Applied Sciences. 12 (2022) 14 - p. 6893 , 2022

Link: https://doi.org/10.3390/..

7

Crack damage control for diamond wire sawing of silicon: Th..:

Ge, Mengran ; Chen, Zibin ; Wang, Peizhi.
Materials Science in Semiconductor Processing. 148 (2022) - p. 106838 , 2022

Link: https://doi.org/10.1016/..

8

Fabrication of thin resin-bonded diamond wire and its appli..:

Ge, Mengran ; Wang, Peizhi ; Bi, Wenbo.
Materials Science in Semiconductor Processing. 126 (2021) - p. 105665 , 2021

Link: https://doi.org/10.1016/..

9

Material removal mechanism and crack propagation in single ..:

Wang, Peizhi ; Ge, Peiqi ; Ge, Mengran..
Ceramics International. 45 (2019) 1 - p. 384-393 , 2019

Link: https://doi.org/10.1016/..

10

Investigation on residual scratch depth and material remova..:

Ge, Mengran ; Zhu, Hongtao ; Ge, Peiqi.
Materials Science in Semiconductor Processing. 100 (2019) - p. 98-105 , 2019

Link: https://doi.org/10.1016/..

11

Fabrication and performance evaluation for resin-bonded dia..:

Ge, Mengran ; Bi, Wenbo ; Ge, Peiqi.
The International Journal of Advanced Manufacturing Technology. 98 (2018) 9-12 - p. 3269-3277 , 2018

Link: https://doi.org/10.1007/..

12

The interaction of periodically distributed parallel cracks..:

Wang, Peizhi ; Ge, Peiqi ; Bi, Wenbo..
Engineering Fracture Mechanics. 199 (2018) - p. 131-142 , 2018

Link: https://doi.org/10.1016/..

13

Investigation on critical crack-free cutting depth for sing..:

Ge, Mengran ; Zhu, Hongtao ; Huang, Chuanzhen..
Materials Science in Semiconductor Processing. 74 (2018) - p. 261-266 , 2018

Link: https://doi.org/10.1016/..

14

Effect of wire speed on subsurface cracks in wire sawing pr..:

Wang, Peizhi ; Ge, Peiqi ; Bi, Wenbo..
Engineering Fracture Mechanics. 184 (2017) - p. 273-285 , 2017

Link: https://doi.org/10.1016/..

15

A scratching force model of diamond abrasive particles in w..:

Wang, Peizhi ; Ge, Peiqi ; Li, Zongqiang..
Materials Science in Semiconductor Processing. 68 (2017) - p. 21-29 , 2017

Link: https://doi.org/10.1016/..