Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Geißler, Ute
70  Ergebnisse:
Personensuche X
?
1

Effect of the loop forming process on the lifetime of alumi..:

Felke, Florens ; Groth, Anne ; Hempel, Martin...
Microelectronics Reliability.  154 (2024)  - p. 115337 , 2024
Link: https://doi.org/10.1016/..
 
?
2

Electrolytical Coating of Inhomogeneous Structures Distribu..:

Böhme, Andrea ; Döhler, Torsten ; Hofmann, Mandy...
Materials Science Forum.  1106 (2023)  - p. 75-80 , 2023
Link: https://doi.org/10.4028/..
 
?
3

Electroplated Micro-Labelling as Copy Protection:

Döhler, Torsten ; Böhme, Andrea ; Hofmann, Mandy...
Open Conference Proceedings.  2 (2022)  - p. 157-161 , 2022
Link: https://doi.org/10.52825..
 
?
4

Microstructuring of the end-surface for silver halide polyc..:

Adomavičiũtė-Grabusovė, Sonata ; Hinkel, Jonas ; Usenov, Iskander...
Optical Materials Express.  12 (2021)  1 - p. 34 , 2021
Link: https://doi.org/10.1364/..
 
?
5

Fabrication of an antireflection microstructure on AgClBr p..:

Tarabrin, Mikhail K. ; Bushunov, Andrey A. ; Teslenko, Andrei A....
Optical Materials Express.  11 (2021)  2 - p. 487 , 2021
Link: https://doi.org/10.1364/..
 
?
6

Study of the Wrinkle Formation in the Heel Zone of Heavy Wi..:

, In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE),
Dohler, Torsten ; Ribbeck, Hans-Georg von ; Fidorra, Fabian.. - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
?
7

Aluminum-Scandium: A Material for Semiconductor Packaging:

Geissler, Ute ; Thomas, Sven ; Schneider-Ramelow, Martin..
Journal of Electronic Materials.  45 (2016)  10 - p. 5456-5467 , 2016
Link: https://doi.org/10.1007/..
 
?
8

Microstructural evolution of ultrasonic-bonded aluminum wir..:

Broll, Marian Sebastian ; Geissler, Ute ; Höfer, Jan...
Microelectronics Reliability.  55 (2015)  6 - p. 961-968 , 2015
Link: https://doi.org/10.1016/..
 
?
9

Development and Status of Cu Ball/Wedge Bonding in 2012:

Schneider-Ramelow, Martin ; Geißler, Ute ; Schmitz, Stefan..
Journal of Electronic Materials.  42 (2013)  3 - p. 558-595 , 2013
Link: https://doi.org/10.1007/..
 
?
10

Quantifying diffusion for an ultrasonic wire bonding proces..:

Sbeiti, Mohamad ; Müller, Wolfgang H. ; Schneider‐Ramelow, Martin..
PAMM.  12 (2012)  1 - p. 369-370 , 2012
Link: https://doi.org/10.1002/..
 
?
11

Thermo‐mechanical description of material diffusion during ..:

Müller, Wolfgang H. ; Sbeiti, Mohamad ; Schneider‐Ramelow, Martin.
PAMM.  11 (2011)  1 - p. 427-428 , 2011
Link: https://doi.org/10.1002/..
 
?
12

Interface Formation in the US-Wedge/Wedge-Bond Process of A..:

Geissler, Ute ; Funck, Jürgen ; Schneider-Ramelow, Martin...
Journal of Electronic Materials.  40 (2010)  2 - p. 239-246 , 2010
Link: https://doi.org/10.1007/..
 
?
13

Verbindungsbildung und Gefügeentwicklung beim Ultraschall-..:

, 2008
Link: http://nbn-resolving.de/..
 
?
14

FIB-Präparation und TEM-Analytik an AlSi1-Bondkontakten:

Geißler, Ute ; Engelmann, Hans-Jürgen ; Urban, Ingrid.
Practical Metallography.  43 (2006)  10 - p. 520-533 , 2006
Link: https://doi.org/10.3139/..
 
?
15

Investigation of microstructural processes during ultrasoni..:

Geißler, Ute ; Schneider-Ramelow, Martin ; Lang, Klaus-Dieter.
Journal of Electronic Materials.  35 (2006)  1 - p. 173-180 , 2006
Link: https://doi.org/10.1007/..
 
1-15