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Proceedings of 4th International Conference on Frontiers in Computing and Systems; Lecture Notes in Networks and Systems ,
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Thermo-electro-mechanical Effects of Copper TSV Interconnec..:
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Lecture Notes in Electrical Engineering; Emerging Electronic Devices, Circuits and Systems ,
3
A Novel Approach to Model and Analyze Wafer–Wafer Hybrid Bo..:
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Lecture Notes in Electrical Engineering; Advanced Manufacturing and Automation XI ,
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An Industrial Application of Cellular Manufacturing Using A..:
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Proceedings of Seventh International Congress on Information and Communication Technology; Lecture Notes in Networks and Systems ,
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