Ginga, Nicholas J.
19  Ergebnisse:
Personensuche X
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1

Investigation of Mechanical Reliability of Flexible/Stretch..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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3

Magnetic Force-Based Measurement Technique to Investigate t..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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4

Thermomechanical Reliability Investigation of Carbon Nanotu..:

Ginga, Nicholas J. ; Sitaraman, Suresh K.
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  8 - p. 1282-1292 , 2022
 
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7

Magnetic-Based Interfacial Adhesion Measurement Technique w..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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9

Biaxial Inflation Stretch Test for Printed Electronics:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
 
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10

Enhanced Interfacial Toughness of Thermoplastic–Epoxy Inter..:

Chen, Yuxin ; Ginga, Nicholas J. ; LePage, William S....
ACS Applied Materials & Interfaces.  11 (2019)  46 - p. 43573-43580 , 2019
 
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11

Integration of Sensors in Gastrointestinal Organoid Culture..:

Kim, Ge-Ah ; Ginga, Nicholas J. ; Takayama, Shuichi
Cellular and Molecular Gastroenterology and Hepatology.  6 (2018)  1 - p. 123-131.e1 , 2018
 
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14

New Method to Measure Tensile Strength of Low Modulus Thin ..:

Ginga, Nicholas J. ; Sitaraman, Suresh K.
International Journal of Fracture.  170 (2011)  2 - p. 199-206 , 2011
 
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