Goh, Simon Chun Kiat
55  Ergebnisse:
Personensuche X
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1

Electrical Characterization and Reliability Studies of Nano..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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2

Multi-Axial Elastic Averaging for Sub-Micron Passive Alignm..:

Goh, Simon Chun Kiat ; Siah, Chun Fei ; Xu, Baochang...
Journal of Lightwave Technology.  41 (2023)  12 - p. 3986-3992 , 2023
 
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3

Plasma-Activated Cu-Cu and Al-Al Direct Bonding for Electro..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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4

Effects of high-temperature thermal annealing on GeSn thin-..:

Wu, Shaoteng ; Son, Bongkwon ; Zhang, Lin...
Journal of Alloys and Compounds.  872 (2021)  - p. 159696 , 2021
 
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7

Time-Dependent Evolution Study of Ar/N2 Plasma-Activated Cu..:

Hu, Liangxing ; Goh, Simon Chun Kiat ; Tao, Jing...
ECS Journal of Solid State Science and Technology.  10 (2021)  12 - p. 124001 , 2021
 
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9

Deposited poly-Si as on-demand linewidth compensator for on..:

Goh, Simon Chun Kiat ; Chen, Nan ; Shiau, Li Lynn...
Journal of Micromechanics and Microengineering.  29 (2019)  4 - p. 047001 , 2019
 
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10

Formation of 45° Silicon (110) Surface Using Triton X-nSurf..:

Goh, Simon Chun Kiat ; Guo, Tina Xin ; Chuan, KaiLiang.
ECS Journal of Solid State Science and Technology.  7 (2018)  12 - p. Q259-Q266 , 2018
 
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11

Development of Nitride-Based Optical Phased Array at 1092 n..:

Lim, Yu Dian ; Goh Chun Kiat, Simon ; Seit, Wen Wei...
IEEE Photonics Technology Letters.  35 (2023)  16 - p. 855-857 , 2023
 
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15

Design and Fabrication of 2.5D Cryogenic Interposer With In..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, HongYu ; Chui, King-Jien ; Kiat Goh, Simon Chun... - p. 458-463 , 2024
 
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