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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
3
Methodologies for Characterization of W2W Bonding Strength:
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
4
Predictive Modeling of Thin Film Yield Stress Using Machine..:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
15