González, Mario A.
16350  Ergebnisse:
Personensuche X
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3

Methodologies for Characterization of W2W Bonding Strength:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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Predictive Modeling of Thin Film Yield Stress Using Machine..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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6

Application of Cyclic Voltammetry with W Electrodes for Mea..:

Felling, Forest ; Dale, Olivia R. ; Gonzalez, Mario..
Journal of The Electrochemical Society.  171 (2024)  1 - p. 017514 , 2024
 
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15

Measurement and Simulation of Mechanical Strength of Back-E..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Vandevelde, Bart ; Cox, Kevin ; Moloudi, Reza... - p. 1-5 , 2023
 
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