Personensuche
X
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
5
Methodologies for Characterization of W2W Bonding Strength:
, In:
?
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
12
Predictive Modeling of Thin Film Yield Stress Using Machine..:
, In:
?
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
14