Gowda, Arun
171  Ergebnisse:
Personensuche X
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1

Enhanced Foam Package Design for Drop/Impact Using Accurate..:

Yin, Pengcheng ; Park, Seungbae ; Jacob, Biju.
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  5 - p. 638-645 , 2023
 
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2

Package Design Through Reliable Predictive Modeling and Its..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Yin, Pengcheng ; Park, Seungbae ; Jacob, Biju.. - p. 1738-1744 , 2022
 
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5

POL-kw Modules for High Power Applications:

, In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),
Yin, Liang ; Nagarkar, Kaustubh ; Gowda, Arun... - p. 1497-1503 , 2017
 
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9

Planar SiC Power Module Packaging and Interconnections Usin..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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11

Rotter's Lymph Nodes—Do We Really Need to Remove During Axi..:

Keelara, Arun Gowda ; Satish, C. ; Rudresh, H. K...
Indian Journal of Surgical Oncology.  12 (2021)  2 - p. 397-400 , 2021
 
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