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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Sustainable-Ink Process Recipes for the Fabrication of Addi..:
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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Demonstration of Functional Circuits with Surface Mount Dev..:
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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Prediction of Print Geometry and Electrical Performance of ..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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Prediction of Electrical Performance and Print Geometry for..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Reliability of Component Attachment using ECA and LTS on Fl..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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Deep Learning Neural Network Approach for Correlation betwe..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
11
Component Attachment to Inkjet Additive Printed Circuits to..:
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Advances in Intelligent Systems and Computing; International Conference on Innovative Computing and Communications ,
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Job Recommendation System Using Content and Collaborative-B..:
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2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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Electrically Conductive Adhesive Interconnections on Additi..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Process-Consistency-Performance Relationships for Additivel..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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