E-LIB Suche - Ergebnisse für: Gu, Jiefei

1

Flip-chip solder bumps defect detection using a self-search..:

Sun, Yu ; Su, Lei ; Gu, Jiefei...
Advanced Engineering Informatics. 60 (2024) - p. 102395 , 2024

Link: https://doi.org/10.1016/..

2

X-ray detection of ceramic packaging chip solder defects ba..:

Li, Ke ; Xu, Linhai ; Su, Lei...
NDT & E International. 143 (2024) - p. 103048 , 2024

Link: https://doi.org/10.1016/..

3

Search for a Dual-Convergence Sparse Feature Extractor With..:

Sun, Yu ; Su, Lei ; Gu, Jiefei...
IEEE Transactions on Industrial Informatics. , 2024

Link: https://doi.org/10.1109/..

4

Category-level selective dual-adversarial network using sig..:

Zhang, Siyu ; Su, Lei ; Gu, Jiefei...
Expert Systems with Applications. 238 (2024) - p. 121879 , 2024

Link: https://doi.org/10.1016/..

5

Rotating machinery fault detection and diagnosis based on d..:

ZHANG, Siyu ; SU, Lei ; GU, Jiefei...
Chinese Journal of Aeronautics. 36 (2023) 1 - p. 45-74 , 2023

Link: https://doi.org/10.1016/..

6

A Novel Three-Probability Spaces Logic Decoupling Distillat..:

Sun, Yu ; Su, Lei ; Gu, Jiefei..
IEEE Transactions on Instrumentation and Measurement. 72 (2023) - p. 1-10 , 2023

Link: https://doi.org/10.1109/..

7

Experimental investigation on the buckling and post-bucklin..:

Zhang, Yahui ; Kong, Bin ; Gu, Jiefei..
Thin-Walled Structures. 184 (2023) - p. 110450 , 2023

Link: https://doi.org/10.1016/..

8

An improved orthogonal matching pursuit method for denoisin..:

Su, Lei ; Tan, Shihong ; Qi, Yang...
Mechanical Systems and Signal Processing. 188 (2023) - p. 110030 , 2023

Link: https://doi.org/10.1016/..

9

Intelligent defect inspection of flip chip based on vibrati..:

Su, Lei ; Hu, Xiao ; Gu, Jiefei...
Measurement. 214 (2023) - p. 112782 , 2023

Link: https://doi.org/10.1016/..

10

Identification of GGT5 as a Novel Prognostic Biomarker for ..:

Wang, Yuli ; Fang, Yuan ; Zhao, Fanchen...
Frontiers in Genetics. 13 (2022) - p. , 2022

Link: https://doi.org/10.3389/..

11

Comprehensive analysis of a novel signature incorporating l..:

Wang, Yuli ; Xu, Jing ; Fang, Yuan...
Frontiers in Immunology. 13 (2022) - p. , 2022

Link: https://doi.org/10.3389/..

12

A novel approach for flip chip inspection based on improved..:

Su, Lei ; Zhang, SiYu ; Ji, Yong...
Science China Technological Sciences. 65 (2022) 5 - p. 1087-1097 , 2022

Link: https://doi.org/10.1007/..

13

Rationalized improvement of Tsai–Wu failure criterion consi..:

Chen, Xiangming ; Sun, Xiasheng ; Chen, Puhui...
Composite Structures. 256 (2021) - p. 113120 , 2021

Link: https://doi.org/10.1016/..

14

A theoretical and experimental assessment of 3D macroscopic..:

Gu, Jiefei ; Chen, Puhui ; Su, Lei.
Composite Structures. 259 (2021) - p. 113466 , 2021

Link: https://doi.org/10.1016/..

15

Visual inspection of steel surface defects based on domain ..:

Zhang, Siyu ; Zhang, Qiuju ; Gu, Jiefei...
Mechanical Systems and Signal Processing. 153 (2021) - p. 107541 , 2021

Link: https://doi.org/10.1016/..