Guangbin, Dou
61  Ergebnisse:
Personensuche X
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1

Effect of isopropyl alcohol, acetic acid and sodium dodecyl..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Guangbin, Dou ; Yike, Zhou ; Yide, Dong - p. 1-4 , 2023
 
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5

Interconnection Performance of Copper Core Solder Joints in..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wu, Qifan ; Yin, Chunyan ; Ming, Xuefei... - p. 1-6 , 2023
 
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6

Selective Laser-induced Etching of Borosilicate Glass In Hy..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhan, Yue ; Yin, Kuibo ; Nie, Meng. - p. 1-6 , 2023
 
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7

Wet-Adhesive Multifunctional Hydrogel with Anti-swelling an..:

Huang, Haizhou ; Shen, Jiaxin ; Wan, Shu...
ACS Applied Materials & Interfaces.  15 (2023)  9 - p. 11549-11562 , 2023
 
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9

Strain Sensor with Enhanced Sensitivity for Wearable Electr..:

Nie, Meng ; Wen, Lei ; Chen, Shuning...
Macromolecular Materials and Engineering.  307 (2022)  2 - p. , 2022
 
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11

Strain Sensor with Enhanced Sensitivity for Wearable Electr..:

Nie, Meng ; Wen, Lei ; Chen, Shuning...
Macromolecular Materials and Engineering.  307 (2021)  2 - p. , 2021
 
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13

System Integration for Plastic Electronics Using Room‐Tempe..:

Dou, Guangbin ; Holmes, Andrew S.
Advanced Engineering Materials.  22 (2020)  5 - p. 1901309 , 2020
 
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14

A method for alleviating the effect of pinhole defects in i..:

Song, Xiaoxiao ; Wang, Qiu ; Liu, Huafeng...
Journal of Micromechanics and Microengineering.  29 (2018)  1 - p. 015012 , 2018
 
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