E-LIB Suche - Ergebnisse für: Gupte, Omkar

1

A Review of Low-Temperature Solders in Microelectronics Pac..:

Jayaram, Vidya ; Gupte, Omkar ; Bhangaonkar, Karan.
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 4 - p. 570-579 , 2023

Link: https://doi.org/10.1109/..

2

Modeling and Design for System-Level Reliability and Warpag..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Jayaram, Vidya ; Gupte, Omkar ; Smet, Vanessa - p. 1060-1067 , 2022

Link: https://doi.org/10.1109/..

3

Solid-state diffusion studies of lead-free solders on gold ..:

Gupte, Omkar ; Murtagian, Gregorio ; Kathaperumal, Mohanalingam..
Journal of Materials Science: Materials in Electronics. 33 (2022) 10 - p. 7679-7690 , 2022

Link: https://doi.org/10.1007/..

4

Thermal aging reliability of socketable, surface-modified s..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),

Gupte, Omkar ; Murtagian, Gregorio ; Tummala, Rao. - p. 512-517 , 2020

Link: https://doi.org/10.1109/..

5

Smooth, All-Solid, Low-Hysteresis, Omniphobic Surfaces with..:

Boban, Mathew ; Golovin, Kevin ; Tobelmann, Brian...
ACS Applied Materials & Interfaces. 10 (2018) 14 - p. 11406-11413 , 2018

Link: https://doi.org/10.1021/..

6

Validation and Efficiency Evaluation of Automated Quality A..:

Dhoundiyal, Mayank ; Rasal, Sachin ; Gupte, Ajinkya...
Journal of Medical Physics. 49 (2024) 2 - p. 311-315 , 2024

Link: https://doi.org/10.4103/..