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Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium ,
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Materials Modification of Lead-Free Solder Alloys with Diff..:
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Reference Module in Materials Science and Materials Engineering ,
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Scaffold modeling advancement in biomaterials application:
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Reference Module in Materials Science and Materials Engineering ,
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Application of neural networks and artificial intelligence ..:
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Sustainable Biopolymer Composites ,
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