E-LIB Suche - Ergebnisse für: Hanss, Alexander

1

Investigations on High-Power LEDs and Solder Interconnects ..:

Schmid, Maximilian ; Zippelius, Andreas ; Hanß, Alexander..
IEEE Transactions on Device and Materials Reliability. 23 (2023) 3 - p. 419-429 , 2023

Link: https://doi.org/10.1109/..

2

Reliability analysis and condition monitoring of SAC+ solde..:

Zippelius, Andreas ; Hanß, Alexander ; Schmid, Maximilian..
Microelectronics Reliability. 129 (2022) - p. 114461 , 2022

Link: https://doi.org/10.1016/..

3

Hybrid Cu particle paste with surface-modified particles fo..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),

Bhogaraju, Sri Krishna ; Mokhtari, Omid ; Pascucci, Jacopo... - p. 1-8 , 2019

Link: https://doi.org/10.23919..

4

Formation of tin-based crystals from a SnAgCu alloy under f..:

Conti, Fosca ; Hanss, Alexander ; Mokhtari, Omid..
New Journal of Chemistry. 42 (2018) 23 - p. 19232-19236 , 2018

Link: https://doi.org/10.1039/..

5

Residual free solder process for fluxless solder pastes:

Hanss, Alexander ; Elger, Gordon
Soldering & Surface Mount Technology. 30 (2018) 2 - p. 118-128 , 2018

Link: https://doi.org/10.1108/..

6

Thermogravimetric investigation on the interaction of formi..:

Conti, Fosca ; Hanss, Alexander ; Fischer, Carolin.
New Journal of Chemistry. 40 (2016) 12 - p. 10482-10487 , 2016

Link: https://doi.org/10.1039/..

7

The influence of the phosphor layer as heat source and up-s..:

Liu, E ; Hanss, Alexander ; Schmid, Maximilian.
Microelectronics Reliability. 67 (2016) - p. 29-37 , 2016

Link: https://doi.org/10.1016/..

8

Transient thermal analysis as measurement method for IC pac..:

Hanß, Alexander ; Schmid, Maximilian ; Liu, E.
Chinese Physics B. 24 (2015) 6 - p. 068105 , 2015

Link: https://doi.org/10.1088/..

9

Analysis of solder joint reliability of high power LEDs by ..:

Elger, Gordon ; Kandaswamy, Shri Vishnu ; Liu, E....
Microelectronics Journal. 46 (2015) 12 - p. 1230-1238 , 2015

Link: https://doi.org/10.1016/..

10

Investigations on High-Power LEDs and Solder Interconnects ..:

Schmid, Maximilian ; Zippelius, Andreas ; Hanß, Alexander..
https://opus4.kobv.de/opus4-haw/frontdoor/index/index/docId/3965. , 2023

Link: https://opus4.kobv.de/op..

11

Reliability analysis and condition monitoring of SAC+ solde..:

Zippelius, Andreas ; Hanss, Alexander ; Schmid, Maximilian..
https://opus4.kobv.de/opus4-haw/frontdoor/index/index/docId/1971. , 2022

Link: https://opus4.kobv.de/op..

12

Investigations on High-Power LEDs and Solder Interconnects ..:

Schmid, Maximilian ; Zippelius, Andreas ; Hanss, Alexander..
https://opus4.kobv.de/opus4-haw/frontdoor/index/index/docId/2879. , 2022

Link: https://opus4.kobv.de/op..

13

RF008 / #350 COMBINED SUPRA-ORBITAL AND OCCIPITAL NERVE STI..:

Plazier, Mark ; Billet, Bart ; Hanssens, Karel...
Neuromodulation: Technology at the Neural Interface. 26 (2023) 8 - p. S110-S111 , 2023

Link: https://doi.org/10.1016/..

14

The German National Pandemic Cohort Network (NAPKON): ratio..:

Schons, Maximilian ; Pilgram, Lisa ; Reese, Jens-Peter...
European Journal of Epidemiology. 37 (2022) 8 - p. 849-870 , 2022

Link: https://doi.org/10.1007/..

15

Distinguishing geometrically identical instruments: Possibi..:

Brauchler, Alexander ; Hose, Dominik ; Ziegler, Pascal..
Journal of Sound and Vibration. 535 (2022) - p. 117071 , 2022

Link: https://doi.org/10.1016/..