E-LIB Suche - Ergebnisse für: Hara, Tohru

1

Resistivity of Thin Copper Interconnection Layers:

Hara, Tohru ; Shimura, Yasu ; Namiki, Ken
Japanese Journal of Applied Physics. 44 (2005) 3L - p. L408 , 2005

Link: https://doi.org/10.1143/..

2

Investigation of copper contamination into interlayer diele..:

Kobayashi, Ichiro ; Miyazawa, Tomoe ; Fujimoto, Masayo..
Thin Solid Films. 462-463 (2004) - p. 231-234 , 2004

Link: https://doi.org/10.1016/..

3

Effect of Stress on the Properties of Copper Lines in Cu In..:

Balakumar, S. ; Kumar, R. ; Shimura, Y....
Electrochemical and Solid-State Letters. 7 (2004) 4 - p. G68 , 2004

Link: https://doi.org/10.1149/..

4

Chemical mechanical polishing of copper layer employing MnO..:

Hara, Tohru ; Balakumar, S.
Thin Solid Films. 462-463 (2004) - p. 186-191 , 2004

Link: https://doi.org/10.1016/..

5

Properties of Cu Layers Deposited on TiZr-Based Barriers an..:

Balakumar, S. ; Hara, Tohru ; Kumar, Rakesh..
Electrochemical and Solid-State Letters. 7 (2004) 8 - p. G175 , 2004

Link: https://doi.org/10.1149/..

6

Measurement of Adhesion Strength in Copper Interconnection ..:

Hara, Tohru ; Uchida, Minoru ; Fujimoto, Masayo...
Electrochemical and Solid-State Letters. 7 (2004) 2 - p. G28 , 2004

Link: https://doi.org/10.1149/..

7

Effect of TaSiN Barrier Layer Composition on Resistivity of..:

Hara, Tohru ; Namiki, Ken
Electrochemical and Solid-State Letters. 7 (2004) 5 - p. C57 , 2004

Link: https://doi.org/10.1149/..

8

The Self-Annealing Phenomenon in Copper Interconnection:

Hara, Tohru ; Toida, Hiroki ; Shimura, Yasuhiro
Electrochemical and Solid-State Letters. 6 (2003) 7 - p. G98 , 2003

Link: https://doi.org/10.1149/..

9

Deposition of Low Resistivity Copper Conductive Layers by E..:

Hara, Tohru ; Shimura, Yasu ; Toida, Hiroki
Electrochemical and Solid-State Letters. 6 (2003) 7 - p. C97 , 2003

Link: https://doi.org/10.1149/..

10

Electroplating of Copper Conductive Layer on the Electroles..:

Hara, Tohru ; Kamijima, Satoshi ; Shimura, Yasuhiro
Electrochemical and Solid-State Letters. 6 (2003) 1 - p. C8 , 2003

Link: https://doi.org/10.1149/..

11

Improved Barrier and Adhesion Properties in Sputtered TaSiN..:

Hara, Tohru ; Yoshida, Yuichi ; Toida, Hiroki
Electrochemical and Solid-State Letters. 5 (2002) 5 - p. G36 , 2002

Link: https://doi.org/10.1149/..

12

Properties of Copper Interconnection Layers Deposited by El..:

Hara, Tohru ; Miyazawa, Kei ; Miyamoto, Mitsuo
Electrochemical and Solid-State Letters. 5 (2002) 1 - p. C1 , 2002

Link: https://doi.org/10.1149/..

13

Properties of Copper Layers Deposited by Electroplating on ..:

Hara, Tohru ; Toida, Hiroki
Electrochemical and Solid-State Letters. 5 (2002) 10 - p. C102 , 2002

Link: https://doi.org/10.1149/..

14

Delamination of Si by high dose H-ion implantation through ..:

Sasaki, Shiho ; Izumi, Tomio ; Hara, Tohru
Materials Science and Engineering: B. 91-92 (2002) - p. 160-163 , 2002

Link: https://doi.org/10.1016/..

15

Control of the (111) Orientation in Copper Interconnection ..:

Hara, Tohru ; Sakata, Kohji ; Yoshida, Yuji
Electrochemical and Solid-State Letters. 5 (2002) 3 - p. C41 , 2002

Link: https://doi.org/10.1149/..