He, Pin-Syuan
75  Ergebnisse:
Personensuche X
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1

Chemical mechanical planarization of nanotwinned copper/pol..:

He, Pin-Syuan ; Tu, Chun-Wei ; Shie, Kai-Cheng...
Journal of Electroanalytical Chemistry.  969 (2024)  - p. 118544 , 2024
 
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2

Characterization of Surface Activation on Nanotwinned Coppe..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lee, Rou-Jun ; He, Pin-Syuan ; Chiu, Wei-Lan... - p. 77-78 , 2024
 
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3

Comparison of Organic and Inorganic Dielectric Hybrid Bondi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
He, Pin-Syuan ; Chen, Chih - p. 1998-2002 , 2024
 
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4

Low Contact Resistance and Low Temperature Hybrid Bonding w..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
He, Pin-Syuan ; Shie, Kai-Cheng ; Chen, Chih - p. 321-323 , 2023
 
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6

Characterization of Nanomechanical Properties and Scratch H..:

Sharma, Mohit ; Chen, Chao-Chang A. ; Chen, Chih.
ECS Journal of Solid State Science and Technology.  11 (2022)  6 - p. 064004 , 2022
 
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13

Collaboration between Law Enforcement Agencies in Combating..:

Wang, Shun-Yung Kevin ; Hsieh, Ming-Li ; Chang, Charles Kuang-Ming..
International Journal of Offender Therapy and Comparative Criminology.  65 (2020)  4 - p. 390-408 , 2020
 
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15

Effects of poly(oxyethylene)-block structure in polyetheram..:

He, Wei-Syuan ; Shih, Yeng-Fong ; Lin, Jiang-Jen.
Composites Part A: Applied Science and Manufacturing.  78 (2015)  - p. 18-26 , 2015
 
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