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Heinig, Andy
16  Ergebnisse:
Personensuche X
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1

BoW Die to Die interface implementation: An open standardiz..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Ahmed, Maudood ; Heinig, Andy ; Kadam, Sneha. - p. 792-796 , 2023
Link: https://doi.org/10.1109/..
 
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2

Advanced Packaging Using Chiplets and Standardized Physical..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Hopsch, Fabian ; Ahmed, Maudood ; Heinig, Andy - p. 7-10 , 2022
Link: https://doi.org/10.1109/..
 
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3

A general approach for degradation modeling to enable a wid..:

Lange, André ; Gonzalez, Fabio A. Velarde ; Giering, Kay-Uwe...
Microelectronics Reliability.  137 (2022)  - p. 114775 , 2022
Link: https://doi.org/10.1016/..
 
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4

In-Package Ring Hybrid Coupler With On-chip Termination:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Trieb, Robert ; Heinig, Andy - p. 271-275 , 2022
Link: https://doi.org/10.1109/..
 
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5

Holistic Die-to-Die Interface Design Methodology for 2.5-D ..:

Chaudhary, Muhammad Waqas ; Heinig, Andy ; Choubey, Bhaskar
IEEE Transactions on Components, Packaging and Manufacturing Technology.  11 (2021)  12 - p. 2171-2182 , 2021
Link: https://doi.org/10.1109/..
 
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6

Interconnect Aware Power Optimization of Low Swing Driver f..:

, In: 2020 27th IEEE International Conference on Electronics, Circuits and Systems (ICECS),
Chaudhary, Muhammad Waqas ; Heinig, Andy ; Choubey, Bhaskar - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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7

13-Gb/s Transmitter for Bunch of Wires Chip-to-Chip Interfa..:

, In: 2020 IEEE 63rd International Midwest Symposium on Circuits and Systems (MWSCAS),
Chaudhary, Muhammad Waqas ; Heinig, Andy ; Choubey, Bhaskar - p. 333-336 , 2020
Link: https://doi.org/10.1109/..
 
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8

Energy-Area Aware Channel Design for Multi-Chip Interfaces:

, In: 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Chaudhary, Muhammad Waqas ; Heinig, Andy ; Choubey, Bhaskar - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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9

Fraunhofer's Initial and Ongoing Contributions in 3D IC Int..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Ramm, Peter ; Klumpp, Armin ; Landesberger, Christof... - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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10

Construction Kit of RF-Blocks in Package Technologies:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Hopsch, Fabian ; Trieb, Robert ; Heinig, Andy - p. 591-594 , 2019
Link: https://doi.org/10.1109/..
 
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11

Low-Cost Chip2Chip Integration for Partitioning Processing ..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Hopsch, Fabian ; Heinig, Andy - p. 511-514 , 2019
Link: https://doi.org/10.1109/..
 
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12

System integration - the bridge between More than Moore and..:

, In: Proceedings of the conference on Design, Automation & Test in Europe,
Heinig, Andy ; Dietrich, Manfred ; Herkersdorf, Andreas... - p. 1-9 , 2014
Link: https://dl.acm.org/doi/1..
 
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13

System integration — The bridge between More than Moore and..:

, In: 2014 Design, Automation & Test in Europe Conference & Exhibition (DATE),
Heinig, Andy ; Dietrich, Manfred ; Herkersdorf, Andreas... - p. 1-9 , 2014
Link: https://doi.org/10.7873/..
 
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14

XML-Based Hierarchical Description of 3D Systems and SIP:

Wolf, Susann ; Heinig, Andy ; Knochel, Uwe
IEEE Design & Test.  30 (2013)  3 - p. 59-69 , 2013
Link: https://doi.org/10.1109/..
 
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15

XML-basierte Sprache für die hierarchische und parametrisie..:

, In: Entwurf integrierter 3D-Systeme der Elektronik,
Wolf, Susann ; Heinig, Andy ; Knöchel, Uwe - p. 107-127 , 2012
Link: https://doi.org/10.1007/..
 
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