E-LIB Suche - Ergebnisse für: Hellings, Geert

1

Impact of Sub-μm Wafer Thinning on Latch-Up Risk in DTCO/ST..:

Serbulova, Kateryna ; Chen, Shih-Hung ; Hellings, Geert...
IEEE Transactions on Electron Devices. 71 (2024) 4 - p. 2278-2283 , 2024

Link: https://doi.org/10.1109/..

2

A 1.8-V GPIO With Design-Technology-Reliability Co-Optimiza..:

Chen, Wen-Chieh ; Chen, Shih-Hung ; Huang, Man-Ching...
IEEE Journal of Solid-State Circuits. , 2024

Link: https://doi.org/10.1109/..

3

Multi-VT Options at Scaled Vertical Pitch in Gate-All-Aroun..:

, In: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),

Gaddemane, Gautam ; Bhuwalka, Krishna ; Rzepa, Gerhard... - p. 1-3 , 2024

Link: https://doi.org/10.1109/..

4

Future Design Direction for SRAM Data Array: Hierarchical S..:

Liu, Hsiao-Hsuan ; Gilardi, Carlo ; Salahuddin, Shairfe M....
IEEE Transactions on Circuits and Systems I: Regular Papers. , 2024

Link: https://doi.org/10.1109/..

5

Compact Modeling and Design Exploration of Non-Destructive ..:

Xiang, Yang ; Mukherjee, Shankha ; Hellings, Geert...
IEEE Transactions on Electron Devices. 71 (2024) 8 - p. 4685-4691 , 2024

Link: https://doi.org/10.1109/..

6

DTCO of Nanosheet and Forksheet Architectures: Exploring Di..:

, In: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),

Gaddemane, Gautam ; Schuddinck, Pieter ; Bhuwalka, Krishna... - p. 1-3 , 2024

Link: https://doi.org/10.1109/..

7

Unraveling the impact of nano-scaling on silicon field-effe..:

Santermans, Sybren ; Hellings, Geert ; Heyns, Marc..
Nanoscale. 15 (2023) 5 - p. 2354-2368 , 2023

Link: https://doi.org/10.1039/..

8

Physics-Based and Closed-Form Model for Cryo-CMOS Subthresh..:

Beckers, Arnout ; Michl, Jakob ; Grill, Alexander...
IEEE Transactions on Nanotechnology. 22 (2023) - p. 590-596 , 2023

Link: https://doi.org/10.1109/..

9

CFET SRAM With Double-Sided Interconnect Design and DTCO Be..:

Liu, Hsiao-Hsuan ; Schuddinck, Pieter ; Pei, Zhenlin...
IEEE Transactions on Electron Devices. 70 (2023) 10 - p. 5099-5106 , 2023

Link: https://doi.org/10.1109/..

10

3D SRAM Macro Design in 3D Nanofabric Process Technology:

Abdi, Dawit Burusie ; Salahuddin, Shairfe M. ; Boemmels, Juergen...
IEEE Transactions on Circuits and Systems I: Regular Papers. 70 (2023) 7 - p. 2858-2867 , 2023

Link: https://doi.org/10.1109/..

11

Investigating Nanowire, Nanosheet and Forksheet FET Hot-Car..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),

Vandemaele, Michiel ; Kaczer, Ben ; Bury, Erik... - p. 1-10 , 2023

Link: https://doi.org/10.1109/..

12

CFET SRAM DTCO, Interconnect Guideline, and Benchmark for C..:

Liu, Hsiao-Hsuan ; Salahuddin, Shairfe M. ; Chan, Boon Teik...
IEEE Transactions on Electron Devices. 70 (2023) 3 - p. 883-890 , 2023

Link: https://doi.org/10.1109/..

13

Co-integration Process Compatible Input/Output (I/O) Device..:

, In: ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC),

Gaddemane, Gautam ; Bhuwalka, Krishna K. ; Matagne, Philippe... - p. 265-268 , 2022

Link: https://doi.org/10.1109/..

14

ESD nMOSFETs in Advanced Bulk FinFET Technology With Dual S..:

Chen, Wen-Chieh ; Chen, Shih-Hung ; Chiarella, Thomas...
IEEE Transactions on Electron Devices. 69 (2022) 9 - p. 5357-5362 , 2022

Link: https://doi.org/10.1109/..

15

A Holistic Evaluation of Buried Power Rails and Back-Side P..:

Nibhanupudi, S. S. Teja ; Prasad, Divya ; Das, Shidhartha...
IEEE Transactions on Electron Devices. 69 (2022) 8 - p. 4453-4459 , 2022

Link: https://doi.org/10.1109/..