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2022 IEEE Applied Power Electronics Conference and Exposition (APEC) ,
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PCB Layout for Chip-Scale Package GaN Fets Optimizes Both E..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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High Resolution Thermoreflectance Imaging and Numerical Mod..:
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2019 IEEE 69th Electronic Components and Technology Conference (ECTC) ,
6
Assessment of CMP Fill Pattern Effect on the Thermal Perfor..:
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2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ,
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Full 3D Thermal Simulation of GaN HEMT using Ultra-Fast Sel..:
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2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ,
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