Personensuche
X
?
2022 IEEE Applied Power Electronics Conference and Exposition (APEC) ,
2
PCB Layout for Chip-Scale Package GaN Fets Optimizes Both E..:
, In:
?
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
3
High Resolution Thermoreflectance Imaging and Numerical Mod..:
, In:
?
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) ,
4
Assessment of CMP Fill Pattern Effect on the Thermal Perfor..:
, In:
?
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ,
7
Full 3D Thermal Simulation of GaN HEMT using Ultra-Fast Sel..:
, In:
?
2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ,
8