Hemken, G.
20  Ergebnisse:
Personensuche X
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2

Adhesive bonding:

, In: Microjoining and Nanojoining,
Böhm, S. ; Stammen, E. ; Hemken, G.. - p. 500-544 , 2008
 
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3

Micro bonding with non-viscous adhesives:

Böhm, S. ; Dilger, K. ; Hesselbach, J....
Microsystem Technologies.  12 (2006)  7 - p. 676-679 , 2006
 
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5

The Use of Computerized Molecular Structure Scanning and Pr..:

Hemken, Heinz G. ; Lehmann F., Pedro A.
Quantitative Structure-Activity Relationships.  11 (1992)  3 - p. 332-338 , 1992
 
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9

Increasing Channel Margin of Distorted Serial Systems:

, In: 2006 IEEE Electrical Performane of Electronic Packaging,
Patel, P. ; Cases, M. ; de Araujo, D.... - p. None , 2006
 
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