E-LIB Suche - Ergebnisse für: Herth, E.

1

Low-loss GaN-on-insulator platform for integrated photonics:

Gromovyi, M. ; El Kurdi, M. ; Checoury, X....
Optics Express. 30 (2022) 12 - p. 20737 , 2022

Link: https://doi.org/10.1364/..

2

Defects management in the gain media of GeSn micro-disk las..:

, In: 2020 IEEE Photonics Conference (IPC),

Wang, B. ; Elbaz, A. ; Herth, E.... - p. 1-2 , 2020

Link: https://doi.org/10.1109/..

3

Long-range Planar Conveyance Device Based On A Digital Elec..:

, In: 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP),

Tisnes, S. Duque ; Shi, Z. ; Herth, E.... - p. 1-5 , 2020

Link: https://doi.org/10.1109/..

4

GaAs manufacturing processes conditions for micro- and nano..:

Joint, F. ; Abadie, C. ; Vigneron, P.B....
Journal of Manufacturing Processes. 60 (2020) - p. 666-672 , 2020

Link: https://doi.org/10.1016/..

5

Electromagnetic analysis for optical coherence tomography b..:

Iff, W. A. ; Hugonin, J.-P. ; Sauvan, C....
Applied Optics. 58 (2019) 27 - p. 7472 , 2019

Link: https://doi.org/10.1364/..

6

Electrical and optical properties of sputtered ultra-thin i..:

Hamouda, F. ; Herth, E. ; David, C....
Journal of Materials Science: Materials in Electronics. 30 (2019) 9 - p. 8508-8514 , 2019

Link: https://doi.org/10.1007/..

7

Advanced and reliable GaAs/AlGaAs ICP-DRIE etching for opto..:

Vigneron, P.B. ; Joint, F. ; Isac, N...
Microelectronic Engineering. 202 (2018) - p. 42-50 , 2018

Link: https://doi.org/10.1016/..

8

Biodevice optimization based on piezoresistive sensor dedic..:

, In: 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP),

Yusifli, E. ; Gharbi, T. ; Yahiaoui, R.... - p. 1-4 , 2016

Link: https://doi.org/10.1109/..

9

GaAs Based on Bulk Acoustic Wave Sensor for Biological Mole..:

Lacour, V. ; Herth, E. ; Lardet-Vieudrin, F...
Procedia Engineering. 120 (2015) - p. 721-726 , 2015

Link: https://doi.org/10.1016/..

10

Towards a miniature atomic scalar magnetometer using a liqu..:

Rutkowski, J. ; Fourcault, W. ; Bertrand, F....
Sensors and Actuators A: Physical. 216 (2014) - p. 386-393 , 2014

Link: https://doi.org/10.1016/..

11

Wafer level packaging compatible with millimeter-wave anten..:

Herth, E. ; Seok, S. ; Rolland, N..
Sensors and Actuators A: Physical. 173 (2012) 1 - p. 238-243 , 2012

Link: https://doi.org/10.1016/..

12

Investigation of optical and chemical bond properties of hy..:

Herth, E. ; Desré, H. ; Algré, E...
Microelectronics Reliability. 52 (2012) 1 - p. 141-146 , 2012

Link: https://doi.org/10.1016/..

13

Optimization of ohmic contact and adhesion on polysilicon i..:

Herth, E. ; Algré, E. ; Legrand, B..
Microelectronic Engineering. 88 (2011) 5 - p. 724-728 , 2011

Link: https://doi.org/10.1016/..

14

Mechanical characterization of aluminium nanofilms:

Guisbiers, G. ; Herth, E. ; Buchaillot, L.
Microelectronic Engineering. 88 (2011) 5 - p. 844-847 , 2011

Link: https://doi.org/10.1016/..

15

Materials selection procedure for RF-MEMS:

Guisbiers, G. ; Herth, E. ; Legrand, B....
Microelectronic Engineering. 87 (2010) 9 - p. 1792-1795 , 2010

Link: https://doi.org/10.1016/..