Hironiwa, Daisuke
26  Ergebnisse:
Personensuche X
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1

Novel plasma process for build-up film in the fine wiring f..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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2

The investigation of dry plasma technology in each steps fo..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Hironiwa, Daisuke ; Chen, Haw Wen ; Morikawa, Yasuhiro.. - p. 1964-1969 , 2022
 
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3

The control of material surface condition for plasma techno..:

, In: 2021 International Conference on Electronics Packaging (ICEP),
 
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4

Polyimide Fine-via Etching and Low-damage Surface-modificat..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
 
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5

Fabrication of fine patterned structure for high-density Fa..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
 
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6

Simple fabrication of back contact heterojunction solar cel..:

Koyama, Koichi ; Yamaguchi, Noboru ; Hironiwa, Daisuke...
Japanese Journal of Applied Physics.  56 (2017)  8S2 - p. 08MB21 , 2017
 
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7

Flexible Cu(In,Ga)Se2 solar cell on stainless steel substra..:

Chantana, Jakapan ; Hironiwa, Daisuke ; Watanabe, Taichi..
Progress in Photovoltaics: Research and Applications.  24 (2016)  7 - p. 990-1000 , 2016
 
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9

Influence of conduction band minimum difference between tra..:

Murata, Masashi ; Chantana, Jakapan ; Ashida, Naoki..
Japanese Journal of Applied Physics.  54 (2015)  3 - p. 032301 , 2015
 
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10

Evaluation of sputtering damage in Cu2ZnSn(S,Se)4solar cell..:

Matsuo, Nobuki ; Hironiwa, Daisuke ; Chantana, Jakapan...
Japanese Journal of Applied Physics.  54 (2015)  4 - p. 042302 , 2015
 
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13

Physical properties of Cu(In,Ga)Se2 film on flexible stainl..:

Chantana, Jakapan ; Hironiwa, Daisuke ; Watanabe, Taichi..
Solar Energy Materials and Solar Cells.  143 (2015)  - p. 510-516 , 2015
 
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