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Ho, Soon Wee
873  Ergebnisse:
Personensuche X
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1

Development of Large RDL Interposer Package using RDL-first..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Ho, Soon Wee ; Boon Soh, Siew ; Lau, Boon Long.. - p. 29-34 , 2023
Link: https://doi.org/10.1109/..
 
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2

Solutions for Process Challenges on Fan-Out Wafer Level Pac..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chia, Lai Yee ; Bhuvanendran Nair Gourikutty, Sajay ; Ho, Soon Wee - p. 20-23 , 2023
Link: https://doi.org/10.1109/..
 
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3

Heterogeneous Integration for Chiplets on FOWLP Development..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Chong, Chai Tai ; Ho, Soon Wee ; Choong, Chong Ser.. - p. 655-659 , 2022
Link: https://doi.org/10.1109/..
 
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4

Development of Two-Tier FO-WLP AiPs for Automotive Radar Ap..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Ho, Soon Wee ; Hsiang-Yao, Hsiao ; Long, Lau Boon... - p. 1376-1383 , 2022
Link: https://doi.org/10.1109/..
 
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5

Wafer Level Package with Polymer Sealed Air Cavity:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Ho, Soon Wee ; Siew Boon, Serine Soh ; Long, Lau Boon. - p. 598-602 , 2022
Link: https://doi.org/10.1109/..
 
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6

Deep Learning Analysis of 3D X-ray Images for Automated Obj..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Pahwa, Ramanpreet ; Nwe, Tin Lay ; Chang, Richard... - p. 221-227 , 2020
Link: https://doi.org/10.1109/..
 
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7

Double Mold Antenna in Package for 77 GHz Automotive Radar:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Ho, Soon Wee ; Boon, Soh Siew ; Long, Lau Boon... - p. 257-261 , 2020
Link: https://doi.org/10.1109/..
 
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8

High Density RDL build-up on FO-WLP using RDL-first Approac:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Ho, Soon Wee ; Hsiang-Yao, Hsiao ; Lim, Simon Siak Boon... - p. 23-27 , 2019
Link: https://doi.org/10.1109/..
 
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9

Design, assembly and reliability of large die and fine-pitc..:

Ong, Yue Ying ; Ho, Soon Wee ; Vaidyanathan, Kripesh...
Microelectronics Reliability.  50 (2010)  7 - p. 986-994 , 2010
Link: https://doi.org/10.1016/..
 
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10

Development of negative profile of dry film resist for meta..:

, In: 2009 11th Electronics Packaging Technology Conference,
Chew, Michelle ; Ho, Soon Wee ; Su, Nandar... - p. None , 2009
Link: https://doi.org/10.1109/..
 
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11

Underfill selection methodology for fine pitch Cu/low-k FCB..:

Ong, Xuefen ; Ho, Soon Wee ; Ong, Yue Ying...
Microelectronics Reliability.  49 (2009)  2 - p. 150-162 , 2009
Link: https://doi.org/10.1016/..
 
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12

Development of thin film dielectric embedded 3D stacked pac..:

, In: 2009 11th Electronics Packaging Technology Conference,
Ho, Soon Wee ; Su, Nandar ; Lim, Li Shiah... - p. None , 2009
Link: https://doi.org/10.1109/..
 
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13

A Systematic Underfill Selection Methodology for Fine Pitch..:

, In: 2007 9th Electronics Packaging Technology Conference,
Ong, Xuefen ; Sohn, Dong Kyun ; Hsia, Liang Choo... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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14

Design, Process and Reliability of Face-up 2-layer molded F..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chong, Chai Tai ; Teck Guan, Lim ; Yong, Han... - p. 19-24 , 2020
Link: https://doi.org/10.1109/..
 
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15

A Novel Packaging Platform for High-Performance Optical Eng..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Gourikutty, Sajay Bhuvanendran Nair ; Jong, Ming Chinq ; Kanna, Chockanathan Vinoth... - p. 422-427 , 2022
Link: https://doi.org/10.1109/..
 
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